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Manufacturer Part #
ATMEGA4809-AFR
20MHz, 48KB, TQFP48, Ind 125C, Green, T&R
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2500 per Reel Package Style:TQFP-48 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip ATMEGA4809-AFR - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected AVR64EA48, AVR32EA48, AVR16EA48, ATMEGA3209, ATMEGA4809, ATMEGA809 and ATMEGA1609 device families available in 48L TQFP (7x7x1mm) package at MTAI assembly site.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:15 January 2025 (date code: 253)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected AVR64EA48, AVR32EA48, AVR16EA48, ATMEGA3209, ATMEGA4809, ATMEGA809 and ATMEGA1609 device families available in 48L TQFP (7x7x1mm) package at MTAI assembly site.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.
***FPCN104919 Update ***Revision History:April 16, 2024: Issued final notification.May 08, 2024: Re-issued final notification. Updated pre and post change summary table to include package type and package width.Description of Change:Implement new carrier tape leader and trailer length for various packages shipped from MPHL site.Reason for Change:To improve manufacturability by standardizing the carrier tape and trailer length for various packages shipped from MPHL site.
Revision History:December 23, 2019: Issued initial notification.February 14, 2020: Issued final notification. Attached the Qualification Report. Updated the pre and post change to add CEL-9240 molding compound material. Provided estimated first ship date to be on March 14, 2020.April 11, 2023: Re-issued final notification. Updated affected parts list to include ATMEGA328PB-ABTVAO catalog part number (CPN).Description of Change: Qualification of MTAI as a new assembly site for selected Atmel products available in 32L (7x7x1.0mm) and 48L TQFP (7x7x1.0mm) package using gold (Au) wire.Pre Change:Assembled at ASCL assembly site using palladium coated copper with gold flash (CuPdAu) bond wire, G700 and CEL-9240 molding compound, EN4900G die attach, and C194-ESH lead frame material with MSL Level 3 classification.
Revision History:June 1, 2019: Issued initial notification.April 4, 2022: Issued cancellation notification.Cancellation Notification:Description of Change:This qualification was originally performed to qualify MTAI assembly site for selected Atmel industrial products available in 48L TQFP (7x7x1mm) package.
Part Status:
Microchip ATMEGA4809-AFR - Technical Attributes
| Family Name: | megaAVR 0 |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 48kB |
| RAM Size: | 6kB |
| Speed: | 20MHz |
| No of I/O Lines: | 41 |
| InterfaceType / Connectivity: | I2C/SPI/USART |
| Peripherals: | Brown-out Detect/POR/PWM |
| Number Of Timers: | 5 |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +125°C |
| On-Chip ADC: | 16-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-48 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2500 per Reel
Package Style:
TQFP-48
Mounting Method:
Surface Mount