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Manufacturer Part #
ATMEGA6490-16AUR
16MHZ, TQFP, IND TEMP, GREEN, 5V, T&R
Microchip ATMEGA6490-16AUR - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of MTAI as an additional final test site for selected ATMEGA3250, ATMEGA3250P, ATMEGA3290, ATMEGA3290P, ATMEGA6450, and ATMEGA6490 device families available in 100L TQFP (14x14x1mm) package.Reason for Change: To improve manufacturability by qualifying MTAI as an additional final test site.
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
PCN Status:Final NotificationDescription of Change:Qualification of OSE as a new final test site for various products available in 32L TQFP (7x7x1mm), 44L TQFP (10x10x1mm), 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages.Reason for Change:To improve on-time delivery performance by qualifying OSE as a new final test site.Change Implementation Status:In ProgressEstimated First Ship Date:September 23, 2024 (date code: 2439)
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
***June 12, 2024: Issued cancellation notification***Description of Change:This qualification was originally performed to qualify TMGR as an additional fabrication site for selected Atmel ATMEGA64xx, ATMEGA12xx, ATMEGA25xx and ATTINY25xx device families available in various packages.Reason for Change:Microchip has decided to not qualify TMGR as an additional fabrication site for selected Atmel ATMEGA64xx, ATMEGA12xx, ATMEGA25xx and ATTINY25xx device families available in various packages.
Description of Change:Qualification of OSE as a new final test site for various products available in 32L TQFP (7x7x1mm), 44L TQFP (10x10x1mm), 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages.Reason for Change:To improve on-time delivery performance by qualifying OSE as a new final test site.
Revision History:July 27, 2023: Issued initial notification.February 05, 2024: Updated affected parts list to remove CPN ATMEGA64L-8AQRA1 due to already EOL; Issued cancellation notification.Reason for Change:Microchip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire for selected AT90CANxx, AT90USBxx and ATMEGAxx device families available in 64L and 100L TQFP (14x14x1mm) packages at MMT assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected AT90CANxx, AT90USBxx and ATMEGAxx device families available in 64L and 100L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire at MMT assembly site.Change Implementation Status:In Progress
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of TMGR as an additional fabrication site for selected Atmel ATMEGA64xx, ATMEGA12xx, ATMEGA25xx and ATTINY25xx device families available in various packages.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying TMGR as an additional fabrication site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:March 2022
Part Status:
Available Packaging
Package Qty:
1500 per Std. Mfr. Pkg