

Référence fabricant
ATMEGA88PB-MUR
IC MCU 8BIT 8KB FLASH 32VFQFN
Microchip ATMEGA88PB-MUR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification of MTAI as an additional assembly site for selected ATMEGA8xxx, ATMEGA16xxx, ATMEGA32xxx andATMEGA48xxx Atmel device families available in 48L VQFN (6x6x0.9mm) and 32L VQFN (5x5x0.9mm) packages.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly site.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATMEGA1608, ATmega168PB, ATMEGA3208, ATmega328PB, ATMEGA4808, ATmega48PB, ATMEGA808, ATmega88PB and AVR16EB32 device families available in 32L VQFN (5x5x0.9mm) package at MP3A assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MP3A assembly site.
***FPCN104919 Update ***Revision History:April 16, 2024: Issued final notification.May 08, 2024: Re-issued final notification. Updated pre and post change summary table to include package type and package width.Description of Change:Implement new carrier tape leader and trailer length for various packages shipped from MPHL site.Reason for Change:To improve manufacturability by standardizing the carrier tape and trailer length for various packages shipped from MPHL site.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATMEGA1608, ATmega168PB, ATMEGA3208, ATmega328PB, ATMEGA4808, ATmega48PB, ATMEGA808, ATmega88PB and AVR16EB32 device families available in 32L VQFN (5x5x0.9mm) package at MP3A assembly site.Pre and Post Change Summary: See attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MP3A assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:February 2024Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Revision History:September 05, 2023: Issued initial notification.October 11, 2023: Issued final notification. Attached the Qualification Report. Modified wire material changes for MTAI and MMT from Au to Au/CuPdAu. Include AVR16EB32-I/RXB and AVR16EB32T-I/RXB catalog part numbers in the affected parts list. Provided estimated first ship date to be on November 15, 2023.PCN Status:Final NotificationPCN Type:Manufacturing Change Description of Change:Qualification of MP3A as an additional assembly site for selected ATMEGAxx and AVR16EB32xx device families available in 32L VQFN (5x5x0.9mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying MP3A as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:November 15, 2023 (date code: 2346)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Revision History:September 22, 2022: Issued initial notification.October 12, 2022: Issued final notification. Attached the Qualification Report. Added Cover tape information in the pre and post change table and comparison file. Provided estimated first ship date to be on November 14, 2022.Description of Change:Qualification of MPHL as an additional test location for selected ATMEGA88PB and ATMEGA48PB device families available in 32L VQFN (5x5x0.9mm) package.Pre and Post Change Summary:see attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying MPHL as an additional test location.Change Implementation Status:In ProgressEstimated First Ship Date:November 14, 2022 (date code: 2247)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary:See attached
Microchip has released a new Product Documents for the ATmega48PB/88PB/168PB - Complete Datasheet of devices.Notification Status: FinalDescription of Change: Revision includes:1. Updated the document to Microchip style.2. Updated Package Information to Microchip style.3. Errata has been moved to a separate document.4. Removed footnote regarding interrupt modes INT0 and INT1 and clarified External Interrupts section.5. Updated 8-bit Timer/Counter Block Diagram figure.6. Updated Analog to Digital Converter Block Schematic Operation block diagram.7. Updated Reset and Interrupt Vectors in ATmega48PB, Reset and Interrupt Vectors in ATmega88PB and Reset and Interrupt Vectors in ATmega168PB tables.8. Updated Electrical characteristics.8.1. Common DC characteristics table8.2. ATmega48PB/88PB DC characteristics table8.3. Calibration Accuracy of Internal RC Oscillator table8.4. Reset, Brown-out and Internal Voltage Characteristics table8.5. ADC Characteristics tableImpacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 20 October 2021
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
6000 par Std. Mfr. Pkg