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Manufacturer Part #
ATTINY1604-SSFR
8-Bit 16MHz 16KB (16K x 8) FLASH 14-SOIC
Microchip ATTINY1604-SSFR - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:14 November 2024 (date code: 2446)
***June 19, 2024: Reissued the initial notification to correct the typographical error in the Notification Subject***Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladiumcoated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
***FPCN104919 Update ***Revision History:April 16, 2024: Issued final notification.May 08, 2024: Re-issued final notification. Updated pre and post change summary table to include package type and package width.Description of Change:Implement new carrier tape leader and trailer length for various packages shipped from MPHL site.Reason for Change:To improve manufacturability by standardizing the carrier tape and trailer length for various packages shipped from MPHL site.
Description of Change:Qualification of CuPdAu as an additional bond wire material for selected ATTINY16xx, ATTINY4xx, ATTINY2xx, ATTINY8xx, ATTINY3224 and PIC16F1xxxx device families available in 14L SOIC (.150in) package assembled at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying CuPdAu as an additional bond wire material.
Description of Change:Qualification of MTAI as an additional Scan/Pack process site and implement packing changes for selected ATTINY804, ATTINY814, ATTINY1604 and ATTINY1614 device families available in 14L SOIC (0.150in) package.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional Scan/Pack process site.
Part Status:
Microchip ATTINY1604-SSFR - Technical Attributes
| Family Name: | ATtiny |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 16kB |
| RAM Size: | 1MB |
| Speed: | 16MHz |
| No of I/O Lines: | 12 |
| InterfaceType / Connectivity: | IrDA/I2C/LINbus/SPI |
| Peripherals: | Brown-out Detect/POR/Reset/Watchdog |
| Number Of Timers: | 3 |
| Supply Voltage: | 2.7V to 5.5V |
| Operating Temperature: | -40°C to +125°C |
| Watchdog Timers: | 1 |
| Moisture Sensitivity Level: | 3 |
| Package Style: | SOIC-14 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOIC-14
Mounting Method:
Surface Mount