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Manufacturer Part #
ATTINY1627-MU
tinyAVR® 2 Family 16KB Flash 2KB RAM 8-Bit Microcontroller - VQFN-24
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:490 per Tray Package Style:VQFN-24 Mounting Method:Surface Mount | ||||||||||
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Microchip ATTINY1627-MU - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as an additional wire material and QMI519 as a new die attach material for selected ATTINY1617, ATTINY807, ATTINY1607, ATTINY3217, ATTINY417, ATTINY1627, ATTINY3227, ATTINY427, ATTINY827, and ATTINY817 device families available in 24L VQFN (4x4x0.9mm) package.Reason for Change: To improve on-time delivery performance by qualifying MP3A as an additional assembly site.Estimated First Ship Date: 05 September 2025 (date code: 2536)
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Document for the ATtiny1624/1626/1627 Silicon Errata and Data Sheet Clarifications of devices.Notification Status: FinalDescription of Change:? Document:? Editorial updates? Added new errata:? Device: 2.2.2. Writing the OSCLOCK Fuse in FUSE.OSCCFG to ?1? Prevents Automatic Loading ofCalibration Values? NVMCTRL: 2.5.1. Wrong Reset Value of NVMCTRL.CTRLA Register? USART: 2.8.3. Receiver Non-Functional after Detection of Inconsistent Synchronization Field? Added new data sheet clarifications:? I/O Multiplexing and Considerations:? 3.1.1. I/O Multiplexing? Electrical Characteristics:? 3.2.1. I/O Pin Characteristics? 3.2.2. SPI - Timing Characteristics? 3.2.3. Programming TimeImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 02 June 2024
PCN Status: Final NotificationDescription of Change: Qualification of MP3A as an additional assembly site for selected ATTINY16xx, ATTINY32xx, ATTINY4xx and ATTINY8xx device families available in 24L VQFN (4x4x0.9mm) package.Reason for Change: To improve on-time delivery performance by qualifying MP3A as an additional assembly site
Description of Change:Qualification of MP3A as an additional assembly site for selected ATTINY16xx, ATTINY32xx, ATTINY4xx and ATTINY8xx device families available in 24L VQFN (4x4x0.9mm) package.Pre and Post Change Summary: See attachedChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying MP3A as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:January 2024Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: see attached
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=ATTINY1627-MU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--8-bit/attiny1627-mu-microchip-5137314
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=ATTINY1627-MU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--8-bit/attiny1627-mu-microchip-5137314
Microchip ATTINY1627-MU - Technical Attributes
| Family Name: | ATtiny |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 16kB |
| RAM Size: | 2kB |
| Speed: | 20MHz |
| No of I/O Lines: | 22 |
| InterfaceType / Connectivity: | I2C/SPI/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Watchdog |
| Number Of Timers: | 3 |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 15-chx12-bit |
| Watchdog Timers: | 1 |
| Package Style: | VQFN-24 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
490 per Tray
Package Style:
VQFN-24
Mounting Method:
Surface Mount