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Manufacturer Part #
ATXMEGA32D3-AU
AVR AVR® XMEGA® D3 Microcontroller IC 8/16-Bit 32MHz 32KB (16K x 16) FLASH 64-TQ
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:90 per Tray | ||||||||||
| Date Code: | |||||||||||
Microchip ATXMEGA32D3-AU - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of palladium-coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATXMEGA128xx, ATXMEGA192xx, ATXMEGA256xx, ATXMEGA32xx, ATXMEGA384xx, and ATXMEGA64xx device families available in 64L and 100L TQFP (14x14x1mm) packages at the MMT assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated Qualification Completion Date: March 2025
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
*** Future PCN99811 update*** Revision History:July 28, 2023: Issued initial notification.November 24, 2023: Issued cancellation notice.Description of Change:This qualification was originally performed to qualify palladium coated copper with gold flash (CuPdAu) bond wire for selected ATXMEGA128x, ATXMEGA192x, ATXMEGA256x, ATXMEGA32x, ATXMEGA384x and ATXMEGA64x device families available in 64L and 100L TQFP (14x14x1mm) package.Impacts to Data Sheet:Not applicableChange Impact:Not applicableReason for ChangeMicrochip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire for selected ATXMEGA128x, ATXMEGA192x, ATXMEGA256x, ATXMEGA32x, ATXMEGA384x and ATXMEGA64x device families available in 64L and 100L TQFP (14x14x1mm) package.Change Implementation Status:Not applicable
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected ATXMEGA128x, ATXMEGA192x, ATXMEGA256x, ATXMEGA32x, ATXMEGA384x and ATXMEGA64x device families available in 64L and 100L TQFP (14x14x1mm) package.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated Qualification Completion Date:November 2023
Part Status:
Available Packaging
Package Qty:
90 per Tray