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Référence fabricant
ATXMEGA64A3U-AU
XMEGA Series 64 KB Flash 4 KB SRAM 32 MHz 8/16-Bit Microcontroller - TQFP-64
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :90 par Std. Mfr. Pkg Style d'emballage :TQFP-64 Méthode de montage :Surface Mount | ||||||||||
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Microchip ATXMEGA64A3U-AU - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
UPDATE to Future PCN 110717Revision History: February 06, 2025: Issued initial notification.August 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 15, 2025.Description of Change: Qualification of palladium-coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATXMEGA128xx, ATXMEGA192xx, ATXMEGA256xx, ATXMEGA32xx, ATXMEGA384xx, and ATXMEGA64xx device families available in 64L and 100L TQFP (14x14x1mm) packages at the MMT assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of palladium-coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATXMEGA128xx, ATXMEGA192xx, ATXMEGA256xx, ATXMEGA32xx, ATXMEGA384xx, and ATXMEGA64xx device families available in 64L and 100L TQFP (14x14x1mm) packages at the MMT assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated Qualification Completion Date: March 2025
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Microchip has released a new Document for the ATxmega256A3U/192A3U/128A3U/64A3U Silicon Errata and Data Sheet Clarifications of devices. If you are using one of these devices please read the document located at ATxmega256A3U/192A3U/128A3U/64A3U Silicon Errata and Data Sheet Clarifications.Notification Status: FinalDescription of Change:Initial document release? Errata content moved from the data sheet and restructured to the new document template? Added new rev I for ATxmega64A3U? Data sheet clarifications added: ? Ordering Information ? Electrical Characteristics: ? ATxmega64A3U ? ATxmega128A3U ? Typical CharacteristicsImpacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 30 Jan 2024NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
*** Future PCN99811 update*** Revision History:July 28, 2023: Issued initial notification.November 24, 2023: Issued cancellation notice.Description of Change:This qualification was originally performed to qualify palladium coated copper with gold flash (CuPdAu) bond wire for selected ATXMEGA128x, ATXMEGA192x, ATXMEGA256x, ATXMEGA32x, ATXMEGA384x and ATXMEGA64x device families available in 64L and 100L TQFP (14x14x1mm) package.Impacts to Data Sheet:Not applicableChange Impact:Not applicableReason for ChangeMicrochip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire for selected ATXMEGA128x, ATXMEGA192x, ATXMEGA256x, ATXMEGA32x, ATXMEGA384x and ATXMEGA64x device families available in 64L and 100L TQFP (14x14x1mm) package.Change Implementation Status:Not applicable
Statut du produit:
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Microchip ATXMEGA64A3U-AU - Caractéristiques techniques
| Family Name: | XMEGA |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 64kB |
| RAM Size: | 4kB |
| Speed: | 32MHz |
| No of I/O Lines: | 50 |
| InterfaceType / Connectivity: | IrDA/I2C/SPI/UART/USART/USB |
| Peripherals: | Brown-out Detect/DMA/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 1.6V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 16-chx12-bit |
| On-Chip DAC: | 2-chx12-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | TQFP-64 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
90 par Std. Mfr. Pkg
Style d'emballage :
TQFP-64
Méthode de montage :
Surface Mount