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Manufacturer Part #
PIC10F204T-E/OT
IC 8 BIT, Microcontroller, 384B Flash, 16B RAM, 4 I/O, Comparator 6 SOT-23 pkg
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel | ||||||||||
| Date Code: | 2507 | ||||||||||
Microchip PIC10F204T-E/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of CuPdAu as a new wire material for selected 24AA014, 24AA025, 24C01C, 24LC014, 24LC025, 24VL014, 24VL025, 25AA010A, 25AA02xx, 25AA040A,25LC010A, 25LC020A, 25LC040A, 34AA02, 34LC02, 34VL02, MTCH101 and PIC10F2xx device families available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve productivity by qualifying CuPdAu as a new wire material at MTAI assembly site.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material for selected 24AA0x, 24C01C, 24LC0x, 24VL0x, 25AA0x, 25LC0x, 34AA02, 34LC02, 34VL02, 93AAx, 93C46x, 93C56x, 93C66x, 93C76x, 93C86x, 93LCx, MCP64x, MCP6V1x, MCP6V3x, MCP6V6x, MCP6V7x, MCP6V8x, MCP6V9x, MCP9x, MTCH101, PIC10F20x, PIC10F22x, device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:05 December 2024 (date code: 2449)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 93LCxxx, 93AAxxx, 93Cxxx, PIC10F2xx, 25LC0xxx, 25AA0xxx, MTCH101,24VL0xx, 24LC0xx, 24AA0xxx, 24C01C, 34VL02, 34LC02, 34AA02, MCP40xx, MCP9800xx, MCP9802xx, MCP738xx, MCP950xx, MCP6Vxxx, and MCP64xx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
Available Packaging
Package Qty:
3000 per Reel