Order by 9pm EDT to ship same day
NEW! Free shipping over $50 USD ($100 CAD). Learn more
Manufacturer Part #
PIC10F220-E/MC
PIC10F Series 384 B Flash 16 B SRAM 8 MHz 8-Bit Microcontroller - DFN-8
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:150 per Tube Package Style:DFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:August 31, 2017: Issued initial notification with PCN No. KSRA-20OSOQ751 April 24, 2018: Issued final notification. Attached the Qualification Report. Provided estimated first ship date on May 24, 2018.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond in selected products of the 160K wafer technology available in 8L DFN package at NSEB assembly site.Pre Change: Using gold (Au) bond wire, 8200T or 8600 die attach material, G770HCD or G700LTD molding compound material and C194 or EFTEC-64T lead frame material.Post Change: Using palladium coated copper with gold flash (CuPdAu) bond wire 8600 die attach material, G700LTD molding compound material and C194 lead frame material.Reason for Change:To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.Estimated First Ship Date:May 24, 2018 (date code: 1821)
Revision History:August 05, 2017: Issued initial notification.August 31, 2017: Re-issued initial notification to include CCB 3073.February 19, 2018: Issued final notification. Attached the Qualification Report. Update subject to remove CCB 3073. Revised the affected parts list. Provided estimated first ship date on March 19, 2018.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond in selected products of the 160K wafer technology available in 8L DFN package at NSEB assembly site.Pre Change:Using gold (Au) bond wire, 8200T or 8600 die attach material, G770HCD or G700LTD molding compound material and C194 or EFTEC-64T lead frame material.Post Change:Using palladium coated copper with gold flash (CuPdAu) bond wire 8600 die attach material, G700LTD molding compound material and C194 lead frame material.Reason for Change:To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.Estimated First Ship Date:March 19, 2018 (date code: 1812)
Revision History:August 05, 2017: Issued initial notification.August 31, 2017: Re-issued initial notification to include CCB 3073.February 19, 2018: Issued final notification. Attached the Qualification Report. Update subject to remove CCB 3073. Revised the affected parts list. Provided estimated first ship date on March 19, 2018.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond in selected products of the 160K wafer technology available in 8L DFN package at NSEB assembly sitePre Change: Using gold (Au) bond wire, 8200T or 8600 die attach material, G770HCD or G700LTD molding compound material and C194 or EFTEC-64T lead frame materialPost Change: Using palladium coated copper with gold flash (CuPdAu) bond wire 8600 die attach material, G700LTD molding compound material and C194 lead frame materialReason for Change:To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.Estimated First Ship Date:March 19, 2018 (date code: 1812)
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
CCB 1474 Initial Notice: Qualification of C194 lead-frame for 8L DFN (2x3x0.9mm) and 8L DFN-S (6x5x0.9mm) packages at NSEB.Description of Change: Qualification of C194 lead-frame for 8L DFN (2x3x0.9mm) and 8L DFN-S (6x5x0.9mm) packages at NSEB.Pre Change: EFTEC-64T lead-framePost Change: EFTEC-64T or C194 lead-frameReason for Change: To improve on-time delivery performance by qualifying an additional lead frame materialNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Product Lifecycle:
-
ROHS Compliant -
Lead Free
Technical Attributes
| Family Name: | PIC10F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 384B |
| RAM Size: | 16B |
| Speed: | 8MHz |
| No of I/O Lines: | 4 |
| Peripherals: | POR/Watchdog |
| Supply Voltage: | 2V to 5.5V |
| Operating Temperature: | -40°C to +125°C |
| On-Chip ADC: | 2-chx8-bit |
| Watchdog Timers: | 1 |
| Package Style: | DFN-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
150 per Tube
Package Style:
DFN-8
Mounting Method:
Surface Mount
