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Manufacturer Part #
PIC12F617-E/MF
PIC12F Series 3.5 kB Flash 128 B SRAM SMT 8-Bit Microcontroller - DFN-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:120 per Tube Package Style:DFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:August 31, 2017: Issued initial notification with PCN No. KSRA-20OSOQ751 April 24, 2018: Issued final notification. Attached the Qualification Report. Provided estimated first ship date on May 24, 2018.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond in selected products of the 160K wafer technology available in 8L DFN package at NSEB assembly site.Pre Change: Using gold (Au) bond wire, 8200T or 8600 die attach material, G770HCD or G700LTD molding compound material and C194 or EFTEC-64T lead frame material.Post Change: Using palladium coated copper with gold flash (CuPdAu) bond wire 8600 die attach material, G700LTD molding compound material and C194 lead frame material.Reason for Change:To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.Estimated First Ship Date:May 24, 2018 (date code: 1821)
Revision History:August 05, 2017: Issued initial notification.August 31, 2017: Re-issued initial notification to include CCB 3073.February 19, 2018: Issued final notification. Attached the Qualification Report. Update subject to remove CCB 3073. Revised the affected parts list. Provided estimated first ship date on March 19, 2018.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond in selected products of the 160K wafer technology available in 8L DFN package at NSEB assembly site.Pre Change:Using gold (Au) bond wire, 8200T or 8600 die attach material, G770HCD or G700LTD molding compound material and C194 or EFTEC-64T lead frame material.Post Change:Using palladium coated copper with gold flash (CuPdAu) bond wire 8600 die attach material, G700LTD molding compound material and C194 lead frame material.Reason for Change:To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.Estimated First Ship Date:March 19, 2018 (date code: 1812)
Revision History:August 05, 2017: Issued initial notification.August 31, 2017: Re-issued initial notification to include CCB 3073.February 19, 2018: Issued final notification. Attached the Qualification Report. Update subject to remove CCB 3073. Revised the affected parts list. Provided estimated first ship date on March 19, 2018.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond in selected products of the 160K wafer technology available in 8L DFN package at NSEB assembly sitePre Change: Using gold (Au) bond wire, 8200T or 8600 die attach material, G770HCD or G700LTD molding compound material and C194 or EFTEC-64T lead frame materialPost Change: Using palladium coated copper with gold flash (CuPdAu) bond wire 8600 die attach material, G700LTD molding compound material and C194 lead frame materialReason for Change:To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.Estimated First Ship Date:March 19, 2018 (date code: 1812)
Product Lifecycle:
Technical Attributes
| Family Name: | PIC12F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 3.5kB |
| RAM Size: | 128B |
| Speed: | 8MHz |
| No of I/O Lines: | 5 |
| Peripherals: | POR/PWM/Watchdog |
| Number Of Timers: | 2 |
| Supply Voltage: | 2V to 5.5V |
| Operating Temperature: | -40°C to +125°C |
| On-Chip ADC: | 4-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | DFN-8 |
| Mounting Method: | Surface Mount |
Features & Applications
Microchip provides solutions for the entire performance range of 8-bit, 16-bit, and 32-bit microcontrollers. The 8-bit PIC® microcontroller solutions feature a powerful architecture, flexible memory technologies, comprehensive easy-to-use development tools, comprehensive application notes, complete technical documentation and post design-in support through a worldwide sales and distribution network. Microchip is committed to easy migration across product families, providing seamless program memory expansion, pin compatibility, and a unified development environment for all products.
PIC12F617-E/MF is part of the PIC12F Series family with a 8-Bit Flash Microcontroller.It can sustain standard temperature ranges from -40°C to +125°C and has 8 pin in DFN package. This device is lead free.
Features:
- Self Read-Write Flash Program Memory
- Internal 4/8MHz oscillator
- Comparator with hysterisis (user configurable)
- Mid-Range core with 35 Instruction, 8 Stack Levels
- 25mA Source/Sink current I/O
- Two 8-bit Timer (TMR0/TMR2)
- One 16-bit Timer (TMR1)
- Watchdog Timer (WDT)
- Enhanced Power-On/Off-Reset
- Brown-Out Reset (BOR)
- In Circuit Serial Programming (ICSP)
- Enhanced Capture Compare PWM (Pulse Width Modulation)
- Wide Operating Voltage (2.0 V – 5.5 V)
Available Packaging
Package Qty:
120 per Tube
Package Style:
DFN-8
Mounting Method:
Surface Mount
