Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.
Please contact your salesperson for assistance.
Manufacturer Part #
PIC16F15225-E/SL
8-bit Microcontrollers - MCU 14KB Flash, 1KB RAM, 10b ADC, 2x PWM, 2x CCP, HLT,
Microchip PIC16F15225-E/SL - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:14 November 2024 (date code: 2446)
***June 19, 2024: Reissued the initial notification to correct the typographical error in the Notification Subject***Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladiumcoated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Description of Change:Qualification of CuPdAu as an additional bond wire material for selected ATTINY16xx, ATTINY4xx, ATTINY2xx, ATTINY8xx, ATTINY3224 and PIC16F1xxxx device families available in 14L SOIC (.150in) package assembled at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying CuPdAu as an additional bond wire material.
Microchip has released a new Errata for the PIC16F15225/45 Silicon Errata and Datasheet Clarifications of devices. Notification Status: FinalDescription of Change: Added silicon errata item 1.6.1; Added silicon revision B3.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteEstimated First Ship Date: 01 Nov 2022
Microchip has released a new Datasheet for the PIC16F15225/45 14/20-Pin Microcontrollers Data Sheet of devices.Notification Status: FinalDescription of Change: Added I2C levels condition; corrected ADCON0 CHS table; updated ADC timing diagrams; updated package drawings; corrected CONFIG1 RSTOSC and FEXTOSC reset values; other minor corrections and improvementsImpacts to Data Sheet: See above details.Reason for Change: To improve productivity.Change Implementation Status: CompleteDate Document Changes Effective: 30 Jun 2022
Microchip has released a new Errata for the PIC16F15225/45 Silicon Errata and Datasheet Clarifications of devices. Description of Change:1) Added silicon revision B2; updated DS revision letter to match latest DS revision.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteEstimated First Ship Date: 31 July 2022
Microchip has released a new Product Documents for the PIC16F15225/45 Silicon Errata and Data Sheet Clarifications of devices.Notification Status: FinalDescription of Change: - Added silicon errata item 1.5.1.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 4 May 2022
Part Status:
Available Packaging
Package Qty:
57 per Std. Mfr. Pkg