

Manufacturer Part #
PIC16F15324T-E/SL
7KB, 512 B RAM, 4xPWMs, Comparator, DAC, ADC, CWG, 2xEUSART, SPI/I2C
Microchip PIC16F15324T-E/SL - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Cancellation NotificationReason for ChangeMicrochip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire material and 104x150 mils lead-frame paddle size for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF15xx and PIC16LF18xx device families available in 14L SOIC (.150in) package.
PCN Status: Initial NotificationPCN Type:Manufacturing Change Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF153xx, PIC16LF183xx, PIC16LF184xx, PIC18F04Q4xx, PIC18F05Q4xx and PIC18F06Q4xx device families available in 14L and 8L SOIC (3.90mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2023Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire material and 104x150 mils lead-frame paddle size for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF15xx and PIC16LF18xx device families available in 14L SOIC (.150in) package.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire material and 104x150 mils lead-frame paddle size.
Microchip has released a new Product Documents for the PIC16(L)F15313/23 Full-Featured 8/14-Pin Microcontroller Data Sheet of devices.Notification Status: FinalDescription of Change: 1) Updated terminology used throughout the data sheet: ?master? replaced by ?host?, and ?slave? replaced by ?client?2) Replaced ADCRC appearances with FRC.3) Updated Figures 30-1, 30-2, 30-3 and 30-4: CWGxISM replaced with CWG1DAT. Updated Section 1, Tables 4-10, 29-2, 31-2, 31-4, 36-3 and 37-6, and Figures 37-5, 37-9, 37-10, 38-14 and 38-15.4) Minor package corrections.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 16 Feb 2022
Microchip has released a new Product Documents for the PIC16(L)F15324/44 Full-Featured 14/16/20-Pin Microcontrollers of devices.Notification Status: FinalDescription of Change: Updated terminology used throughout the data sheet: "master" replaced by "host", and "slave" replaced by "client". Replaced ADCRC appearances with FRCUpdated Figures 30-1, 30-2, 30-3 and 30-4: CWGxISM replaced with CWG1DAT. Updated Tables 4-10, 29-2, 31-4, 36-3 and 37-6, and Figures 37-5, 37-9 and 37-11.Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 10 Sept 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the PIC16(L)F15324/44 Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: 1) Updated Table 2 and 37-1 and Section 1.3 Minimum VDD Specifications. Other minor corrections.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 26 Mar 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Available Packaging
Package Qty:
2600 per Std. Mfr. Pkg