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Manufacturer Part #
PIC16F15344-I/GZ
IC MCU 8BIT 7KB FLASH 20UQFN
Microchip PIC16F15344-I/GZ - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: This qualification was initially performed to qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change: Microchip has decided to not qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Revision History: March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.December 17, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list to add PIC18F46K22-E/MVC01 and PIC18F46K22T-E/MVC01 catalog part numbers. Updated post change mold compound material to NEPL Proprietary. Provided estimated first ship date to be on January 15, 2025.February 11, 2025: Re-issued final notification to include the Lead-frame package at MMT in the post change summary table. March 12, 2025: Issued cancellation notification.
PCN Status:Final NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Revision History:March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Microchip has released a new Product Documents for the PIC16(L)F15313/23 Full-Featured 8/14-Pin Microcontroller Data Sheet of devices.Notification Status: FinalDescription of Change: 1) Updated terminology used throughout the data sheet: ?master? replaced by ?host?, and ?slave? replaced by ?client?2) Replaced ADCRC appearances with FRC.3) Updated Figures 30-1, 30-2, 30-3 and 30-4: CWGxISM replaced with CWG1DAT. Updated Section 1, Tables 4-10, 29-2, 31-2, 31-4, 36-3 and 37-6, and Figures 37-5, 37-9, 37-10, 38-14 and 38-15.4) Minor package corrections.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 16 Feb 2022
Microchip has released a new Product Documents for the PIC16(L)F15324/44 Full-Featured 14/16/20-Pin Microcontrollers of devices.Notification Status: FinalDescription of Change: Updated terminology used throughout the data sheet: "master" replaced by "host", and "slave" replaced by "client". Replaced ADCRC appearances with FRCUpdated Figures 30-1, 30-2, 30-3 and 30-4: CWGxISM replaced with CWG1DAT. Updated Tables 4-10, 29-2, 31-4, 36-3 and 37-6, and Figures 37-5, 37-9 and 37-11.Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 10 Sept 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Available Packaging
Package Qty:
91 per Std. Mfr. Pkg