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Manufacturer Part #
PIC16F15354-I/ML
8-bit Microcontrollers - MCU 7KB, 512B RAM, 4xPWMs, Comparator, DAC, ADC, CWG, 4
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:61 per Std. Mfr. Pkg | ||||||||||
| Date Code: | |||||||||||
Microchip PIC16F15354-I/ML - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected PIC16F15344, PIC16F1535x, PIC16F1537x, PIC16F18346, PIC16F1885x, PIC16F1887x, PIC16F1919x, PIC18F24K4x, PIC18F25K4x, PIC18F25K83, PIC18F26K4x, PIC18F26K83, PIC18F27K4x, PIC18F45K4x, PIC18F46K4x, PIC18F47K4x, PIC18F65K40, PIC18F66K40 and PIC18F67K40 device families available in various packages assembled at MTAI.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material and QMI519 as a new die attach material assembled at MTAI.Estimated First Ship Date: 05 August 2025 (date code: 2532)
Microchip has released a new Errata for the PIC16(L)F15354/55 Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at PIC16(L)F15354/55 Family Silicon Errata and Data Sheet Clarification.ERRATA - PIC16(L)F15354/55 Family Silicon Errata and Data Sheet ClarificationNotification Status: FinalDescription of Change: Updated data sheet revision letterImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 25 Oct 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Datasheet for the PIC16(L)F15354/55 Full-Featured 28-Pin Microcontrollers of devices. If you are using one of these devices please read the document located at PIC16(L)F15354/55 Full-Featured 28-Pin Microcontrollers.Data Sheet - PIC16(L)F15354/55 Full-Featured 28-Pin MicrocontrollersNotification Status: FinalDescription of Change: Updated Table 3; Registers 14-3, 14-27, and 20-1Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 25 Oct 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Microchip has released a new Product Documents for the PIC16(L)F15313/23 Full-Featured 8/14-Pin Microcontroller Data Sheet of devices.Notification Status: FinalDescription of Change: 1) Updated terminology used throughout the data sheet: ?master? replaced by ?host?, and ?slave? replaced by ?client?2) Replaced ADCRC appearances with FRC.3) Updated Figures 30-1, 30-2, 30-3 and 30-4: CWGxISM replaced with CWG1DAT. Updated Section 1, Tables 4-10, 29-2, 31-2, 31-4, 36-3 and 37-6, and Figures 37-5, 37-9, 37-10, 38-14 and 38-15.4) Minor package corrections.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 16 Feb 2022
Microchip has released a new Product Documents for the PIC16(L)F15354/55 Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: 1) Added Silicon Revision A4Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteEstimated First Ship Date: 28 Dec 2021
Description of Change:1. Updated terminology used throughout the data sheet: ?master? replaced by ?host?, and ?slave? replaced by ?client?. Replaced ADCRC appearances with FRC.2. Updated package information to include QFN and VQFN (6x6mm) packaging replaces PDIP with SPDIP packaging.3. Updated figures 30-1, 30-2, 30-3 and 30-4. CWGxISM replaced with CWG1DAT. Updated Tables 4-10, 29-2, 31-2, 31-4,36-3 and 37-6, and Figures 37-5, 37-9 and 37-10.Reason for Change: To Improve Productivity
Part Status:
Available Packaging
Package Qty:
61 per Std. Mfr. Pkg