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Manufacturer Part #
PIC16F18346-E/SS
Microchip PIC16F18346-E/SS - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected PIC16F18344, PIC16F18444, PIC16F18445, PIC16F18446, PIC16F18345, PIC18F16Q20, PIC18F14Q40, PIC18F15Q40, PIC18F14Q41, PIC18F15Q41, PIC16F18346, PIC16F15345, AVR32DU20, AVR16DU20, PIC16F15344, PIC18F14Q20 and PIC18F15Q20 device families available in 20L SSOP (.209in) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying coated copper with gold flash (CuPdAu) as a new bond wire material
Microchip has released a new Document for the PIC16(L)F18326/18346 Family Silicon Errata and Data Sheet Clarifications of devices. Notification Status: FinalDescription of Change:Added Silicon rev. A4.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 22 Jul 2024
Microchip has released a new Product Documents for the PIC16(L)F18326/18346 Full-Featured, Low Pin Count MCUs with XLP of devices. If you are using one of these devices please read the document located at PIC16(L)F18326/18346 Full-Featured, Low Pin Count MCUs with XLP.Notification Status: FinalDescription of Change:1) Updated terminology used throughout the data sheet: ?master? replaced by ?host?, and ?slave? replaced by ?client?.2) Updated Table 3, Figures 7-1, 35-9, 35-10 and 35-11, and Sections 7.5, 27.4 and 36.0 DC and AC Characteristics Graphs and Charts. Other minor corrections. Added the 16-Lead QFN (ML) package drawingImpacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 17 Mar 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Microchip has released a new Product Documents for the PIC16(L)F18326/18346 Family Silicon Errata and Data Sheet Clarification of devices.Description of Change: Added Silicon issue 3.3 FVR Accuracy Reason for Change: To Improve Productivity Date Document Changes Effective: 21 October 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Available Packaging
Package Qty:
67 per Std. Mfr. Pkg