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Manufacturer Part #
PIC16F18876-I/MV
8-bit Microcontrollers - MCU 8-Bit MCU 28KB Flash 2KB RAM 256B EE CIP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:73 per Tube | ||||||||||
| Date Code: | |||||||||||
Product Specification
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Microchip has released a new Product Documents for the PIC16(L)F18856/18876 Family Silicon Errata and Data Sheet Clarification of devices.Description of Change: 1) Added Module 1.3 (ADC Offset Error). Reason for Change: To Improve ProductivityDate Document Changes Effective: 11 Feb 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the PIC16(L)F18856/76 Data Sheet of devices.Description of Change: 1) Updated Figures 10-5, 20-1, and 20-3; Tables 6-1, 9-2, 13-1, 28-4, 27-18, and 37-6; Updated Registers 4-3, 6-4, 18-3, 20-8. 2) Removed Register 26-6. Updated Sections 12.10.1, 18.2, 19.1, and 28.8. 3) Added 40-pin VQFN (5x5) pin diagram 4) added three 40-Lead VQFN (5x5x0.9 mm) diagrams in Package Details 5) updated package marking information with 40-Lead VQFN (5x5x0.9 mm) 6) updated Product Identification System. 7) Other minor corrections Reason for Change: To Improve Productivity Date Document Changes Effective: 03 Feb 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the PIC16(L)F18856/18876 Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: 1.) Added silicon revision A5.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteEstimated First Ship Date: 17 Oct 2020NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts. Markings to Distinguish Revised from Unrevised Devices: Traceability Code
Revision History:March 19, 2020: Issued initial notification.August 10, 2020: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date to be on August 17, 2020.Description of Change: Qualification of MMT as an additional assembly site for selected products available in 40L(5x5x0.5mm), 28L (4x4x0.55mm) and 16L UQFN (4x4x0.5mm) packages.Pre Change:Assembled at NSEB assembly site.Post Change:Assembled at NSEB assembly site or assembled at MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site. Estimated First Ship Date:August 17, 2020 (date code: 2034)
Microchip has released a new Product Documents for the PIC16(L)F18856/18876 Family Silicon Errata and Data Sheet Clarification of devices.Description of Change: Added Module 8 (Comparators)Reason for Change: To Improve ProductivityDate Document Changes Effective: 01 April 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 40L(5x5x0.5mm), 28L (4x4x0.55mm) and 16L UQFN (4x4x0.5mm) packages.Pre Change:Assembled at NSEB assembly site.Post Change:Assembled at NSEB assembly site or assembled at MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:June 2020
Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products for 250K wafer technology available in 40L UQFN package at NSEB assembly site Pre Change: Using gold (Au) bond wire material.Post Change: Using palladium coated copper with gold flash (CuPdAu) bond wire material.Reason for Change:To improve manufacturability and qualify CuPdAu bond wire at NSEB assembly site.Please be advised that after the estimated first ship date customers may receive pre and post change parts
Microchip has released a new DeviceDoc for the PIC16(L)F18856/76 Data Sheet of devices.Description of Change: 1) Added packaging specification information for the 28-lead VQFN (4x4mm) package. 2) Minor correctionsReason for Change: To Improve ManufacturabilityDate Document Changes Effective: 05 Aug 2019NOTE: Please be advised that this is a change to the document only the product has not been changed.
Notification subject: ERRATA - PIC16(L)F18856/18876 Family Silicon Errata and Data Sheet ClarificationNotification text: SYST-13XJZQ795Microchip has released a new DeviceDoc for the PIC16(L)F18856/18876 Family Silicon Errata and Data Sheet Clarification of devices.If you are using one of these devices please read the document located at PIC16(L)F18856/18876 Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change: 1.) Updated to include silicon revision A3 2.) Added Module 7 (Secondary Oscillator) and a row in Table 2.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteEstimated First Ship Date: 14 Aug 2018NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Markings to Distinguish Revised from Unrevised Devices: Traceability Code
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Available Packaging
Package Qty:
73 per Tube