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Manufacturer Part #
PIC16LF15324-I/P
IC MCU 8BIT 7KB FLASH 14DIP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:30 per Tube Package Style:DIP-14 Mounting Method:Through Hole | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Type:Document ChangeNotification Subject:Data Sheet - PIC16(L)F15324/44 Full-Featured 14/16/20-Pin MicrocontrollersNotification Status: FinalDescription of Change: Updated Memory section, section 4.2.3 and 40.1; Tables 2, 37-5, 37-11, and 37-13; Figures 37-10, 37-11. Other minor corrections.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 28 Sep 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Description of Change:Qualification of G600V as an additional/alternative mold compound material for selected products available in 8L, 14L, 16L, 18L, 20L, 28L, 40L PDIP and 28L SPDIP packages at MMT assembly site using gold (Au) wire.Pre Change:Using GE800 mold compound material.Post Change:Using GE800 mold compound material or using G600V mold compound material.Reason for Change:To improve on time delivery performance by qualifying G600V as an addition/alternative mold compound material for selected PDIP and SPDIP packages at MMT assembly site. Because of factory shutdowns due to the COVID-19 pandemic, we must quickly implement this change or risk not having material to ship. Estimated First Ship Date:April 30, 2020 (date code: 2018)
Description of Change:Qualification of G600V as an additional/alternative mold compound material for selected products available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at MMT assembly site using palladium coated copper wire with gold flash (CuPdAu) bond wire.Pre Change:Using GE800 mold compound material.Post Change:Using GE800 or G600V mold compound material.Reason for Change:To improve on time delivery performance by qualifying G600V as an addition/alternative mold compound material for selected PDIP and SPDIP packages at MMT assembly site. Because of factory shutdowns due to the COVID-19 pandemic, we must quickly implement this change or risk not having material to ship.Estimated First Ship Date:April 30, 2020 (date code: 2018)
PIC16(L)F15324/44 Family Silicon Errata and Data Sheet Clarification Description of Change: Updated Table 1, Table 2 and section 1. Added new section 3, section 4 and section 5. Added section 6. Other minor corrections.Data Sheet Clarifications:Added Module 1: Table 36.3 Instruction SetReason for Change: To Improve ProductivityPlease be advised that this is a change to the document only the product has not been changed.
Microchip has released a new DeviceDoc for the PIC16(L)F15324/44 Full-Featured 14/16/20-Pin Microcontrollers of devices.Description of Change: 1) Updated the Cover Pages. 2) Updated Figures 24-2, 33-2, 33-5, 33-7, 33-8, and 33- 12; Registers 5-1, 9-6, 23-4, 23-5, and 30-9; Sections 4.2.2, 20.2.4, 23-2, 23.6, 30.12, 33.1.2.2, 33.1.2.3, 33.1.2.7, 33.1.2.8, 33.1.2.9, 33.3.1, 33.3.2, 33.3.3, 33.3.3.1, 33.3.5, 33.4.1.5,33.4.1.9, 33.4.2.3, 33.4.2.4, and 33.5.1; Tables 3, 4, 4-4, 9-1, 15-1, 15-2, 28-5, 29- 3, 30-2, 30-3, 37-2, 37-3, 37-8, 37-12 and 37-14. 3) Added Table 37-26. Added Characterization Data.Reason for Change:To Improve ManufacturabilityDate Document Changes Effective: 11 Feb 2019NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new DeviceDoc for the PIC16(L)F15313/23 Full-Featured 8/14-Pin Microcontroller Data Sheet of devices.Description of Change:1) Updated Figures 24-2, 32-3, 33-5, 33-6, 33-7, 33-8, and 33-12; Registers 5-1, 9-6, 10-5, 10-6, 14-1, 23-3, 23-4, and 30-9; Sections 4.2.2, 15.3, 19.0, 20.2.4, 23.2, 23.6, 24.3, 33.1.2.2, 33.1.2.3, 33.1.2.7, 33.1.2.8, 33.1.2.9, 33.3.1, 33.3.2, 33.3.3, 33.3.3.1, 33.3.5, 33.4.1.5, 33.4.1.9, 33.4.2.3, 33.4.2.4, and 33.5.1; Tables 4, 4-8, 1-2, 1-3, 9-1, 15-1, 15-2, 20-3, 28-5, 29-3, 30-2, 37-2, 37-3 and 37-8.2) Updated Flexible Oscillator Structure (cover pages).3) Added Table 37-26. Added Characterization data. Removed Preliminary.Reason for Change: To Improve ManufacturabilityDate Document Changes Effective: 18 Jan 2019.NOTE: Please be advised that this is a change to the document only the product has not been changed.
Product Lifecycle:
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ROHS Compliant -
Lead Free
Technical Attributes
| Family Name: | PIC16 |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 7kB |
| RAM Size: | 512B |
| Speed: | 32MHz |
| No of I/O Lines: | 12 |
| InterfaceType / Connectivity: | I2C/LINbus/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset |
| Supply Voltage: | 1.8V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 4-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | DIP-14 |
| Mounting Method: | Through Hole |
Available Packaging
Package Qty:
30 per Tube
Package Style:
DIP-14
Mounting Method:
Through Hole
