

Manufacturer Part #
PIC16LF18326-I/JQ
IC MCU 8BIT Microcontroller 28KB, 2KB RAM, 256B EEPROM, In a 16 pin UQFN pkg
Microchip PIC16LF18326-I/JQ - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: This qualification was initially performed to qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change: Microchip has decided to not qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Revision History: March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.December 17, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list to add PIC18F46K22-E/MVC01 and PIC18F46K22T-E/MVC01 catalog part numbers. Updated post change mold compound material to NEPL Proprietary. Provided estimated first ship date to be on January 15, 2025.February 11, 2025: Re-issued final notification to include the Lead-frame package at MMT in the post change summary table. March 12, 2025: Issued cancellation notification.
PCN Status:Final NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Description of Change: Qualification of MPHL as an additional final test site for selected PIC16F1708, PIC16F785, PIC16F18346, PIC16F15345, PIC16F1704, PIC16F1824, PIC16F1783, PIC16F18345, PIC16F18325, PIC16F18326 andPIC16F15325 device families available in various packages.Reason for Change: To improve productivity and on-time delivery performance by qualifying MPHL as an additional final test site.
Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Microchip has released a new Document for the PIC16(L)F18326/18346 Family Silicon Errata and Data Sheet Clarifications of devices. Notification Status: FinalDescription of Change:Added Silicon rev. A4.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 22 Jul 2024
Revision History:March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Description of Change:Qualification of C194 as an additional lead-frame for selected PIC16F18426, PIC16F18425, PIC16F18424, PIC16F15324, PIC16F18326, PIC16F15323, and PIC16F15325 device families available in 16L UQFN (4x4x0.5mm) package.Reason for Change:Improve manufacturability by qualifying C194 as an additional lead-frame.
Revision History:November 25, 2021: Issued initial notification.November 17, 2023: Issued cancellation notification.PCN Status:Cancellation Notification Description of Change:This qualification was originally performed to qualify A194 lead frame as an additional lead frame material for selected products available in 40L UQFN (5x5x0.5mm), 28L UQFN (4x4x0.55mm), 20L UQFN (4x4x0.5mm), 16L UQFN (4x4x0.5mm), and 16L UQFN (3x3x0.5mm) packages.Impacts to Data Sheet:Not applicableChange Impact:Not applicableReason for ChangeMicrochip has decided to not qualify A194 lead frame as an additional lead frame material for selected products available in 40L UQFN (5x5x0.5mm), 28L UQFN (4x4x0.55mm), 20L UQFN (4x4x0.5mm), 16L UQFN (4x4x0.5mm), and 16L UQFN (3x3x0.5mm) packages.Change Implementation Status:Not applicableEstimated Qualification Completion Date:Not applicable
Microchip has released a new Product Documents for the PIC16(L)F18326/18346 Full-Featured, Low Pin Count MCUs with XLP of devices. If you are using one of these devices please read the document located at PIC16(L)F18326/18346 Full-Featured, Low Pin Count MCUs with XLP.Notification Status: FinalDescription of Change:1) Updated terminology used throughout the data sheet: ?master? replaced by ?host?, and ?slave? replaced by ?client?.2) Updated Table 3, Figures 7-1, 35-9, 35-10 and 35-11, and Sections 7.5, 27.4 and 36.0 DC and AC Characteristics Graphs and Charts. Other minor corrections. Added the 16-Lead QFN (ML) package drawingImpacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 17 Mar 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Part Status:
Available Packaging
Package Qty:
91 per Std. Mfr. Pkg