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Manufacturer Part #
PIC16LF18445T-I/GZ
IC MCU 8BIT 14KB FLASH 20UQFN
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:UQFN-20 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC16LF18445T-I/GZ - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: This qualification was initially performed to qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change: Microchip has decided to not qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Revision History: March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.December 17, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list to add PIC18F46K22-E/MVC01 and PIC18F46K22T-E/MVC01 catalog part numbers. Updated post change mold compound material to NEPL Proprietary. Provided estimated first ship date to be on January 15, 2025.February 11, 2025: Re-issued final notification to include the Lead-frame package at MMT in the post change summary table. March 12, 2025: Issued cancellation notification.
PCN Status:Final NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Revision History:March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Microchip has released a new Errata for the PIC16(L)F18425/45 Silicon Errata and Data Sheet Clarifications of devices.Notification Status: FinalDescription of Change: ? New document, split from Microchip errata DS40002052B. This errata documents current silicon and data sheet issues for the PIC16(L)F18425/45 family and its data sheet (DS40002002). Refer to DS40002052 for a complete history.? Added new Silicon Revision (A2)? Updated Table.1 - Silicon Device Identification? Added new errata: ? 1.1.2, Double Sample Conversions (ADCC) ? 1.2.1, Missing Codes with FVR Reference ? 1.3.1, The I2C Start and/or Stop Flags May Be Set When I2C Is Enabled ? 1.4.1, Low-Voltage Programming Not Possible ? 1.6.2, PFM Back to Back Writes ? 1.7.1, Wrong Duty Cycle for CCP Module ? 1.8.1, Reset Bit (SMT) ? 1.9.1, Synchronous Mode Transmissions (USART) ? 1.9.2, Double Byte Transmit (USART)Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteEstimated First Ship Date: 21 December 2022
Part Status:
Microchip PIC16LF18445T-I/GZ - Technical Attributes
| Family Name: | PIC16F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 14kB |
| RAM Size: | 1kB |
| Speed: | 32MHz |
| No of I/O Lines: | 17 |
| InterfaceType / Connectivity: | I2C/SPI/USART |
| Peripherals: | BOR/POR/PWM |
| Number Of Timers: | 8 |
| Supply Voltage: | 1.8V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 17-chx12-bit |
| On-Chip DAC: | 1-chx5-bit |
| Watchdog Timers: | 1 |
| Package Style: | UQFN-20 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
UQFN-20
Mounting Method:
Surface Mount