Manufacturer Part #
IC MCU 8BIT 14KB FLASH 20UQFN
Microchip PIC16LF18445T-I/GZ - Product Specification
Microchip has released a new Errata for the PIC16(L)F18425/45 Silicon Errata and Data Sheet Clarifications of devices.Notification Status: FinalDescription of Change: • New document, split from Microchip errata DS40002052B. This errata documents current silicon and data sheet issues for the PIC16(L)F18425/45 family and its data sheet (DS40002002). Refer to DS40002052 for a complete history.• Added new Silicon Revision (A2)• Updated Table.1 - Silicon Device Identification• Added new errata: – 1.1.2, Double Sample Conversions (ADCC) – 1.2.1, Missing Codes with FVR Reference – 1.3.1, The I2C Start and/or Stop Flags May Be Set When I2C Is Enabled – 1.4.1, Low-Voltage Programming Not Possible – 1.6.2, PFM Back to Back Writes – 1.7.1, Wrong Duty Cycle for CCP Module – 1.8.1, Reset Bit (SMT) – 1.9.1, Synchronous Mode Transmissions (USART) – 1.9.2, Double Byte Transmit (USART)Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteEstimated First Ship Date: 21 December 2022
Microchip has released a new Product Documents for the PIC16(L)F18425/45 14/20-Pin Full-Featured Low Pin Count MCU with XLP Data Sheet of devices.Description of Change:• General improvement of the documentation and its structure• Updated terminology used throughout the data sheet: Master is replaced by host Slave is replaced by client• Updated RSEL in the TxRST register Reason for Change: To Improve Manufacturability
CCB 4181.004, 4181.005 and 4181.006 Final Notice: Qualification of MMT as an additional assembly site for selected products available in 16L (3x3x0.5mm), 16L (4x4x0.5mm), 20L (4x4x0.5mm) and 28L (4x4x0.5mm) packages.Pre Change: Assembled at NSEB assembly site using 8200T or 8600 die attach, G770HCD or G700LTD mold compound material and lead frame without lead lock.Post Change: Assembled at NSEB assembly site using 8200T or 8600 die attach, G770HCD or G700LTD mold compound material and lead frame without lead lock.Or Assembled at MMT assembly site using 8600 die attach, G700LTD mold compound material and lead frame with lead lock.Impacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:January 15, 2021 (date code: 2103)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts. Revision History:December 04, 2020: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on January 15, 2021.
Microchip has released a new Product Documents for the PIC16(L)F18424/44/25/45 Family Silicon Errata and Data Sheet Clarification of devices. Notification Status: FinalDescription of Change: This revision includes the following updates to Data Sheet Clarifications:1) Adding Silicon issue 1.2.2 for Electrical Spec2) Other minor corrections.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 26 Nov 2020 NOTE: Please be advised that this is a change to the document only the product has not been changed.