
Manufacturer Part #
PIC17C756A-16I/PT
PIC17 Series 32 kB Flash 902 B RAM 16 MHz 8-Bit Microcontroller - TQFP-64
Microchip PIC17C756A-16I/PT - Product Specification
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Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Part Status:
Microchip PIC17C756A-16I/PT - Technical Attributes
Family Name: | PIC17 |
Core Processor: | PIC |
Program Memory Type: | EPROM |
Flash Size (Bytes): | 32kB |
RAM Size: | 902B |
Speed: | 16MHz |
No of I/O Lines: | 50 |
InterfaceType / Connectivity: | I2C/SPI/USART |
Peripherals: | I2C/On-Chip-ADC/PWM/SPI/USART/Watchdog |
Number Of Timers: | 4 |
Supply Voltage: | 3V to 5.5V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 12-chx10-bit |
Watchdog Timers: | 1 |
Package Style: | TQFP-64 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
160 per Tray
Package Style:
TQFP-64
Mounting Method:
Surface Mount