
Manufacturer Part #
PIC18F24K20-I/SO
PIC18F Series 16 kB Flash 768 B RAM 64 MHz 8-Bit Microcontroller - SOIC-28
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Mfr. Name: | Microchip | ||||||||||
Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:27 per Tube Package Style:SOIC-28 Mounting Method:Surface Mount | ||||||||||
Date Code: | 1530 |
Product Specification
Shipping Information:
ECCN:
PCN Information:
Notification subject: CCB 3217 and CCB 3217.001 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly sitePCN Status:Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly sitePre Change: Using palladium coated copper wire (PdCu) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wireImpacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wireChange Implementation Status: In ProgressEstimated First Ship Date: September 16, 2018 (date code: 1838)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Method to Identify Change: Traceability codeRevision History: March 08, 2018: Issued initial notification.August 16, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on September 16, 2018. The change described in this PCN does not alter Microchip's
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly site.Pre Change: Using palladium coated copper wire (PdCu) bond wire.Post Change:Using palladium coated copper with gold flash (CuPdAu) bond wireReason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire Estimated Qualification Completion Date:April 2018
Product Lifecycle:
Technical Attributes
Family Name: | PIC18 |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 16kB |
RAM Size: | 768B |
Speed: | 64MHz |
No of I/O Lines: | 25 |
InterfaceType / Connectivity: | I2C/SPI/USART |
Peripherals: | Analog Comparators/I2C/On-Chip-ADC/PWM/SPI/USART/Watchdog |
Number Of Timers: | 4 |
Supply Voltage: | 1.8V to 3.6V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 11-chx10-bit |
Watchdog Timers: | 1 |
Package Style: | SOIC-28 |
Mounting Method: | Surface Mount |
Features & Applications
Features:
- C Compiler Optimized Architecture
- 16-bit wide instructions, 8-bit wide data path
- Priority levels for interrupts
- 31-level, software accessible hardware stack
- 8 x 8 single-cycle hardware multiplier
- Frequencies range of 31 kHz to 16 MHz
- Four crystal modes up to 64 MHz
- Two external clock modes up to 64 MHz
- 4X Phase Lock Loop (PLL)
- Secondary oscillator using Timer1 @ 32 kHz
- Fail-Safe Clock Monitor
- Allows for safe shutdown if peripheral clock stops
- Two-Speed Oscillator Start-up Special Microcontroller
- Auto-acquisition capability
- Conversion available during Sleep
- Three programmable external interrupts
- Four programmable interrupt-on-change
- Eight programmable weak pull-ups
- I2C™ Master and Slave modes with address mask
- Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) module
Available Packaging
Package Qty:
27 per Tube
Package Style:
SOIC-28
Mounting Method:
Surface Mount