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Manufacturer Part #
PIC18F25K42-I/SP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:15 per Tube | ||||||||||
| Date Code: | |||||||||||
Product Specification
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Description of Change:Qualification of G600V as an additional/alternative mold compound material for selected products available in 8L, 14L, 16L, 18L, 20L, 28L, 40L PDIP and 28L SPDIP packages at MMT assembly site using gold (Au) wire.Pre Change:Using GE800 mold compound material.Post Change:Using GE800 mold compound material or using G600V mold compound material.Reason for Change:To improve on time delivery performance by qualifying G600V as an addition/alternative mold compound material for selected PDIP and SPDIP packages at MMT assembly site. Because of factory shutdowns due to the COVID-19 pandemic, we must quickly implement this change or risk not having material to ship. Estimated First Ship Date:April 30, 2020 (date code: 2018)
Description of Change:Qualification of G600V as an additional/alternative mold compound material for selected products available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at MMT assembly site using palladium coated copper wire with gold flash (CuPdAu) bond wire.Pre Change:Using GE800 mold compound material.Post Change:Using GE800 or G600V mold compound material.Reason for Change:To improve on time delivery performance by qualifying G600V as an addition/alternative mold compound material for selected PDIP and SPDIP packages at MMT assembly site. Because of factory shutdowns due to the COVID-19 pandemic, we must quickly implement this change or risk not having material to ship.Estimated First Ship Date:April 30, 2020 (date code: 2018)
ERRATA - PIC18(L)F24/25K42 Silicon Errata and Data Sheet Clarification Errata Document Revision Description of Change:1) Added Silicon Revision A4. Added Modules 2.4 ADC Conversion; 3.9 Auto-baud; 4.6 I2C Receive 2) Data Sheet Clarifications: DC and AC Characteristics Graphs and Charts: Correction to Figure 45-20 IDD, HFINTOSC Doze Mode, FOSC = 16 MHz, PIC18F24/25K42 Only.Reason for Change: To Improve Productivity.Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Description of Change:1) Updated examples 13-3, 13-4 and 15-13) Updated figures 3-1, 3-2, 3-11, 3-18, 3-19, 3-20, 30-1, 30-3, 33-5, 33-6, 33- 7, 33-8, 33-9, 33-10, 33-11, 33-21, and 33-224) Updated Registers 33-1, 33-2, 33-3, 33-6, 33-7, 33-8, 33-10, 33-11, 33-12, 33-13, 33-14, 33-15, 33-17, 33-21, 36-1, 36-3, 36-5, 36-7, 36-22, 36-23, 36-31, 36-32, 35-33, 36-27, 36-34, & 36-355) Updated sections 4.5.6, 7.1, 7.2.1.2, 7.2.1.3, 7.2.2, 7.2.2.3, 7.2.2.4, 11.0, 16.2.9, 13.1.2.4, 15.6.1, 15.6.2, 17.5, 23.1.2, 27.0, 27.1.1, 33.2, 33.3.7, 33.3.8, 33.3.9, 33.3.10.1, 33.3.10.2, 33.3.10.3, 33.3.12, 33.3.12.1, 33.3.12.2, 33.3.13, 33.4.2, 33.4.3, 33.4.3.1, 33.4.3.2, 33.4.3.3, 33.4.3.4, 33.4.3.5, 33.5, 33.5.1.1, 33.5.1.2, 33.5.9, 33.5.10, 33.5.11, 33.5.12, 33.6, 36.1.4, 36.1.5, 36.1.6, 36.2.2, 36.2.3, 36.2.4, 36.5.4, 36.6, 36.6.1, 36.6.2, 36.6.3, 36.6.4, 36.6.5, 36.6.6, 36.6.7, 36.6.8, 36.6.9, 39.8, 41.1, 41.1.1, 41.2, 41.2.5 and 45.06) Updated tables 15-2, 33-18, 36-1, 36.2, 36-4, 36-5, 36-6, 41-1, 41-2, 41-3, 44-2, 44-3, 44-8, 44-11, 44-12, 44-15, and 44-15.7) Removed Preliminary and added characterization data graphs..Reason for Change: To Improve Manufacturability Date Document Changes Effective: 09 May 2019NOTE: Please be advised that this is a change to the document only the product has not been changed.
ERRATA - PIC18(L)F24/25K42 Silicon Errata and Data Sheet ClarificationNotification Status: FinalDescription of Change: 1) Added Modules 1.2: DMA in Doze Mode; 2.2 ADC Conversion; and 2.3 Burst Average Mode Double Sampling. 2) Added new Modules 8: NVM Control, 9: WWDT, and 10: Power-Saving Operation Modes. 3) Updated 3.4. 4) Remove A2 from Affected Silicon Revisions in ADC Conversion.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 23 Nov 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Data Sheet - PIC18(L)F24/25K42 28-Pin, Low-Power High-Performance MCUs with XLP TechnologyDescription of Change: 1) Added Section 5.7: Device Information Area and 5.8: Device Configuration Information. Added Section 10.1.2. 2) Updated Family Types table. Updated Chapter 37.0; Temperature Indicator Module; Figure 37-1, Registers 9-3 through 9-6, 9-8 through 9-10, 31- 4, and 31-5; Sections 10.1, 10.1.1, 10.1.2, 16.0, 16.3.10, 31.6, 31.6.1, 31.6.2, and 31.13.2; and Tables 1-1, 5-1, 10-2, 16-1, 16-12, and 36-6. 3) Deleted Register 18-10, 18-11, 18-12; Sections 6.0, 7.0, 16.9 and 18.1; and Table 15-2.NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new DeviceDoc for the PIC18(L)F24/25K42 Silicon Errata and Data Sheet Clarification of devices.Description of Change: 1) Added Silicon Revision A2. 2) Added 3.4 Baud Rate Generator Speed Select 3) 3.5 Stop Bit Interrupt Flag renumbered sections. 4) Other minor corrections.Reason for Change: To Improve ProductivityEstimated First Ship Date: 15 April 2018NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Product Lifecycle:
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ROHS Compliant -
Lead Free
Available Packaging
Package Qty:
15 per Tube
