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Manufacturer Part #
PIC18F26K42-I/SS
PIC XLP 18K MCU IC 8-Bit 64MHz 64KB (32K x 16) FLASH 28-SSOP
Microchip PIC18F26K42-I/SS - Product Specification
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Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material for selected PIC16F18xx, PIC18F24xx, PIC18F25xx, PIC18F26xx, PIC16F15xx, PIC18F27xx, AVR64DU2xx, AVR32DA2xx, AVR64DD2xx, AVR32DD2xx, AVR16DD2xx, PIC16F19xx, AVR128DBxx, AVR64DB2xx, AVR32DB2xx, AVR128DAxx, AVR64DA2xx, AVR32DU2xx and AVR16DU2xx device families available in 28L SSOP (.209in) at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material.
Microchip has released a new Product Documents for the PIC18(L)F26/45/46/55/56K42 Silicon Errata and Data Sheet Clarification of devices. Notification Status: FinalDescription of Change: - Added Module 9.4 Double Sample Conversions, 13 Central Processing Unit (CPU), and 13.1 FSR Shadow Registers.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 11 May 2022
Microchip has released a new Product Documents for the PIC18(L)F26/45/46/55/56K42 Silicon Errata and Data Sheet Clarification of devicesNotification Status: FinalDescription of Change: - Added Module 9.4 Double Sample Conversions, 13 Central Processing Unit (CPU), and 13.1 FSR Shadow Registers.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 11 May 2022
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47 per Std. Mfr. Pkg