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Manufacturer Part #
PIC18F46K40-I/MV
PIC18F Series 64 kB Flash 3.6 KB RAM 64 MHz 8-Bit Microcontroller - UQFN-40
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:73 per Tube Package Style:UQFN-40 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC18F46K40-I/MV - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: This qualification was initially performed to qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change: Microchip has decided to not qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Revision History: March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.December 17, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list to add PIC18F46K22-E/MVC01 and PIC18F46K22T-E/MVC01 catalog part numbers. Updated post change mold compound material to NEPL Proprietary. Provided estimated first ship date to be on January 15, 2025.February 11, 2025: Re-issued final notification to include the Lead-frame package at MMT in the post change summary table. March 12, 2025: Issued cancellation notification.
PCN Status:Final NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Microchip has released a new Datasheet for the PIC18(L)F26/45/46K40 28/40/44-Pin, Low-Power, High-Performance Microcontrollers with XLP Technology Data Sheet of devices. Notification Status: FinalDescription of Change:Updated reset values for IPR0, IPR3, TMR0H and BAUDxCON.Added data sheet clarifications.Other minor editorial corrections.Impacts to Data Sheet: See above details.Reason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 10 Oct 2024
Microchip has released a new Document for the PIC18(L)F26/45/46K40 Family Silicon Errata and Data Sheet Clarification of devices. Notification Status: FinalDescription of Change:Updated document format to most current version; silicon issues are renumbered accordingly.Added silicon issue 1.7.2 (TMR0H Register Does Not Increment).Updated data sheet revision level and removed existing data sheet clarifications.Other minor editorial corrections.Impacts to Data Sheet: None.Reason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 10 Oct 2024
Revision History:March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Revision History:November 25, 2021: Issued initial notification.November 17, 2023: Issued cancellation notification.PCN Status:Cancellation Notification Description of Change:This qualification was originally performed to qualify A194 lead frame as an additional lead frame material for selected products available in 40L UQFN (5x5x0.5mm), 28L UQFN (4x4x0.55mm), 20L UQFN (4x4x0.5mm), 16L UQFN (4x4x0.5mm), and 16L UQFN (3x3x0.5mm) packages.Impacts to Data Sheet:Not applicableChange Impact:Not applicableReason for ChangeMicrochip has decided to not qualify A194 lead frame as an additional lead frame material for selected products available in 40L UQFN (5x5x0.5mm), 28L UQFN (4x4x0.55mm), 20L UQFN (4x4x0.5mm), 16L UQFN (4x4x0.5mm), and 16L UQFN (3x3x0.5mm) packages.Change Implementation Status:Not applicableEstimated Qualification Completion Date:Not applicable
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected HA7621T, PIC16Fxxx, PIC16LF1xxx, PIC18F4xxx and PIC18LF4xxx device families available in 40L UQFN (5x5x0.5mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2023
Microchip has released a new Errata for the PIC18(L)F26/45/46K40 Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at PIC18(L)F26/45/46K40 Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change: Update PFM back-to-back workaround. Move software breakpoints to PIC18 Debug Executive.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 07 Oct 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
Part Status:
Microchip PIC18F46K40-I/MV - Technical Attributes
| Family Name: | PIC18F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 64kB |
| RAM Size: | 3.6kB |
| Speed: | 64MHz |
| No of I/O Lines: | 36 |
| InterfaceType / Connectivity: | I2C/LIN/SPI/UART/USART |
| Peripherals: | Brown-out Detect/LVD/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 2.3V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 35-chx10-bit |
| On-Chip DAC: | 1-chx5-bit |
| Watchdog Timers: | 1 |
| Package Style: | UQFN-40 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
73 per Tube
Package Style:
UQFN-40
Mounting Method:
Surface Mount