
Manufacturer Part #
PIC18LF13K22-I/ML
PIC18 Series 8 kB Flash 256 B RAM SMT 8-Bit Microcontroller - QFN-20
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Mfr. Name: | Microchip | ||||||||||
Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:91 per Tube Package Style:QFN-20 Mounting Method:Surface Mount | ||||||||||
Date Code: |
Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies in 44L, 28 QFN-S, 20L,16L and 28L QFN packages.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site Estimated First Ship Date:June 24, 2018 (date code:1826)
Description of Change:Qualification of MMT as an additional assembly site for selected products of 200K wafer technology available in 64L QFN (9x9mm) ,44L QFN (8x8mm), 28L QFN (6x6mm and 5x5mm),28L QFN-S (6x6mm and 5x5mm), 20L QFN (5x5mm and 4x4mm), and 16L QFN (4x4mm and 3x3mm) QFN packages.Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI and MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated First Ship Date:June 08, 2018 (date code: 1823)
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 200K wafer technology available in 20L QFN package at NSEB assembly site.Pre Change: Assembled using gold (Au) bond wire, 8200T or 8600 die attach material and G770HCD or G700LTD molding compound materialPost Change: Assembled using palladium coated copper with gold flash (CuPdAu) bond wire, 8600 die attach material, G700LTD molding compound material
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm, SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies available in 44L, 28L QFN-S, 20L,16L and 28L QFN packages..Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly siteReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:April 2018
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm, SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies available in 44L, 28L QFN-S, 20L,16L and 28L QFN packages.Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly siteReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Description of Change:Qualification of MMT as an additional assembly site for selected product of 200K wafer technology available in 64L, 44L, 28L, 20L and 16L QFN packages.Pre Change: Assembled at MTAI assembly sitePost Change:Assembled at MTAI and MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date : April 2018
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Product Lifecycle:
Technical Attributes
Family Name: | PIC18 |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 8kB |
RAM Size: | 256B |
Speed: | 64MHz |
No of I/O Lines: | 17 |
InterfaceType / Connectivity: | I2C/LIN/SPI/UART |
Peripherals: | POR/PWM/Watchdog |
Number Of Timers: | 4 |
Supply Voltage: | 1.8V to 5.5V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 12-chx10-bit |
Watchdog Timers: | 1 |
Package Style: | QFN-20 |
Mounting Method: | Surface Mount |
Features & Applications
Features:
- High-Performance RISC CPU:
- C Compiler Optimized Architecture:
- Optional extended instruction set designed to optimize re-entrant code
- 256 bytes Data EEPROM
- Up to 16 Kbytes Linear Program Memory Addressing
- Up to 512 bytes Linear Data Memory Addressing
- Up to 16 MIPS Operation
- C Compiler Optimized Architecture:
- Flexible Oscillator Structure:
- Precision 16 MHz Internal Oscillator Block:
- Factory calibrated to ± 1%
- Software selectable frequencies range of 31 kHz to 16 MHz
- 64 MHz performance available using PLL – no external components required
- Four Crystal modes up to 64 MHz
- Two External Clock modes up to 64 MHz
- Precision 16 MHz Internal Oscillator Block:
- Special Microcontroller Features:
- Full 5.5 V Operation – PIC18F1XK22
- 1.8 V-3.6 V Operation – PIC18LF1XK22
- Self-reprogrammable under Software Control
- Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
- Programmable Brown-out Reset (BOR)
- Extreme Low-Power Management with nanoWatt XLP:
- Sleep mode: 34 nA
- Watchdog Timer: 460 nA
- Timer1 Oscillator: 650 nA @ 32 kHz
- Analog Features:
- Analog-to-Digital Converter (ADC) module
- 10-bit resolution, 12 channels
- Auto acquisition capability
- Conversion available during Sleep
- Analog Comparator module:
- Two rail-to-rail analog comparators
- Independent input multiplexing
- Inputs and outputs externally accessible
- Analog-to-Digital Converter (ADC) module
- Peripheral Features:
Available Packaging
Package Qty:
91 per Tube
Package Style:
QFN-20
Mounting Method:
Surface Mount