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Manufacturer Part #
PIC18LF45K22T-I/MV
44 pin, 32 KB Flash, 1536 bytes-RAM, 36 I/0
Microchip PIC18LF45K22T-I/MV - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: This qualification was initially performed to qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change: Microchip has decided to not qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Revision History: March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.December 17, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list to add PIC18F46K22-E/MVC01 and PIC18F46K22T-E/MVC01 catalog part numbers. Updated post change mold compound material to NEPL Proprietary. Provided estimated first ship date to be on January 15, 2025.February 11, 2025: Re-issued final notification to include the Lead-frame package at MMT in the post change summary table. March 12, 2025: Issued cancellation notification.
PCN Status:Final NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Revision History:March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Revision History:November 25, 2021: Issued initial notification.November 17, 2023: Issued cancellation notification.PCN Status:Cancellation Notification Description of Change:This qualification was originally performed to qualify A194 lead frame as an additional lead frame material for selected products available in 40L UQFN (5x5x0.5mm), 28L UQFN (4x4x0.55mm), 20L UQFN (4x4x0.5mm), 16L UQFN (4x4x0.5mm), and 16L UQFN (3x3x0.5mm) packages.Impacts to Data Sheet:Not applicableChange Impact:Not applicableReason for ChangeMicrochip has decided to not qualify A194 lead frame as an additional lead frame material for selected products available in 40L UQFN (5x5x0.5mm), 28L UQFN (4x4x0.55mm), 20L UQFN (4x4x0.5mm), 16L UQFN (4x4x0.5mm), and 16L UQFN (3x3x0.5mm) packages.Change Implementation Status:Not applicableEstimated Qualification Completion Date:Not applicable
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected HA7621T, PIC16Fxxx, PIC16LF1xxx, PIC18F4xxx and PIC18LF4xxx device families available in 40L UQFN (5x5x0.5mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2023
Microchip has released a new Product Documents for the PIC18(L)F26/45/46/55/56K42 Silicon Errata and Data Sheet Clarification of devicesNotification Status: FinalDescription of Change: - Added Module 9.4 Double Sample Conversions, 13 Central Processing Unit (CPU), and 13.1 FSR Shadow Registers.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 11 May 2022
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of A194 lead frame as an additional lead frame material for selected products available in 40L UQFN (5x5x0.5mm), 28L UQFN (4x4x0.55mm), 20L UQFN (4x4x0.5mm), 16L UQFN (4x4x0.5mm), and 16L UQFN (3x3x0.5mm) packages.Impacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve productivity by qualifying A194 lead frame as an addition lead frame material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:December 2021
Microchip has released a new Product Documents for the PIC18(L)F2X/4XK22 Data Sheet of devices.Description of Change: 1) Updated Register 9-162) Other minor corrections Reason for Change: To Improve Manufacturability Date Document Changes Effective: 31 Mar 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Available Packaging
Package Qty:
3300 per Std. Mfr. Pkg