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Manufacturer Part #
ATF1502AS-10AU44
ATF1502AS Series EEPROM Complex Programmable Logic Surface Mount - TQFP-44
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:160 per Tray | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
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PCN Information:
Description of Change: Qualification of MTAI as an additional final test site for selected Atmel ATF1502AS, ATF1502ASL andATF1504ASV device families available in 44L TQFP (10x10x1mm) package.Pre Change: Tested at MPHL final test sitePost Change:Tested at MPHL or MTAI final test siteImpacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve manufacturability by qualifying MTAI as an additional final test site.Change Implementation Status:In ProgressEstimated First Ship Date:November 29, 2020 (date code: 2049)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Revision History:October 29, 2020: Issued final notification
Description of Change: Qualification of MTAI as an additional assembly site for selected Atmel products available in 44L TQFP 10x10x1mm package.Pre Change:Assembled at ASE using palladium coated copper with gold flash (CuPdAu) or palladium coated copper (PdCu) or Gold (Au) bond wire, CRM-1076WA or CRM-2288A die attach, G631 or G700 mold compound and C7025 lead frame material or Assembled at LPI using palladium coated copper with gold flash (CuPdAu) or Gold (Au) bond wire, CRM-1033BF die attach, G700 mold compound material and C7025 lead frame materialPost Change:Assembled at ASE using palladium coated copper with gold flash (CuPdAu) or palladium coated copper (PdCu) or Gold (Au) bond wire, CRM-1076WA or CRM-2288A die attach, G631 or G700 mold compound and C7025 lead frame material or Assembled at LPI using palladium coated copper with gold flash (CuPdAu) or Gold (Au) bond wire, CRM-1033BF die attach , G700 mold compound and C7025 lead frame material or Assembled at MTAI using Gold (Au) bond wire, 3280 die attach, G700 mold compound and C7025 lead frame material.Reason for Change:To improve on time delivery performance by qualifying MTAI as an additional assembly site.Estimated First Ship Date: August 24, 2020 (date code: 2035)
Part Status:
Technical Attributes
| No of I/O Lines: | 36 |
| No of Macrocells: | 32 |
| System Gates: | 750 |
| No of Logic Elements: | 2 |
| Propagation Delay: | 10ns |
| Supply Voltage: | 4.5V to 5.5V |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| Frequency: | 125MHz |
| No of Pins: | 44 |
| Leakage Current: | 10µA |
Available Packaging
Package Qty:
160 per Tray