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Manufacturer Part #
ATECC608A-SSHDA-T
ATECC608A Series 5.5 V 1 MHz I2C Microchip CryptoAuthentication™ Device - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:4000 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip ATECC608A-SSHDA-T - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:June 24, 2022: Issued initial notification.October 27, 2022: Issued final notification. Updated affected CPN list to include catalog part numbers (CPN) released prior issuance of the Final PCN. Attached the qualification report and added estimated first ship date by November 04, 2022Description of Change:Qualification of MTAI as an additional final test site for selected ATECC108A-SSxxx-x, ATECC508A-SSxxx-x, ATECC608A-SSxxx-x, ATECC608B-SSxxx-x and ATSHA204A-SSxxx-x device families available in 8L SOIC (3.90mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional final test site.
Cancellation Notification: (Previously Issued under Future PCN 90029)Revision History:May 11, 2022: Issued initial notification. November 09, 2022: Issued cancellation notificationDescription of Change:This qualification was originally performed to qualify MTAI as an additional assembly site for selected ATECC108A, ATECC508A, ATSHA204A, ATECC608A, ATECC608B and ECC608-TFLXWPC device families available in 8L SOIC (3.90mm) package. Reason for Change:Microchip has decided to not qualify MTAI as an additional assembly site for selected
Revision History:September 13, 2022: Issued initial notification.October 18, 2022: Issued final notification. Attached the Qualification Report. Revised the Impact to datasheet from Yes to None. Revised the ASSH plant name from ASE Advanced Semiconductor (Shanghai) Co., Ltd. to ATX Semiconductor (Shanghai)Co., Ltd. Provided estimated first ship date to be on October 31, 2022.Description of Change:Qualification of MTAI as an additional assembly site for selected ATECC108A, ATECC508A, ATSHA204A, ATECC608A, ATECC608B and ECC608-TFLXWPC device families available in 8L SOIC (3.90mm) package using QMI519 die attach material.Pre and Post Change Summary: : see attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly.Change Implementation Status:In ProgressEstimated First Ship Date:October 31, 2022 (date code: 2245)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary:: see attached
Description of Change:Qualification of MTAI as an additional assembly site for selected ATECC108A, ATECC508A, ATSHA204A, ATECC608A, ATECC608B and ECC608-TFLXWPC device families available in 8L SOIC (3.90mm) package using QMI519 die attach material.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly.
Description of Change:Qualification of MTAI as an additional final test site for selected ATECC108A-SSxxx-x, ATECC508A-SSxxx-x, ATECC608A-SSxxx-x, ATECC608B-SSxxx-x and ATSHA204A-SSxxx-x device families available in 8L SOIC (3.90mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional final test site.
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MTAI as an additional assembly site for selected ATECC108A, ATECC508A, ATSHA204A, ATECC608A, ATECC608B and ECC608-TFLXWPC device families available in 8L SOIC (3.90mm) package.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying MTAI as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:August 2022
Revision History: October 20, 2020: Issued Information notification. Attached is the qualification report and added new products availability date.October 23, 2020: Re-issued information notification. Updated the PCN number of qualification report. October 29, 2020: Re-issued information notification to align the products availability date in PCNletter and Affected_CPN list for 3L CONTACT and 8L UDFN package from October 19 to October 20, 2020.Description of Change: Introduction of new ATECC608B device family available in 3L CONTACT, 8LUDFN and 8L SOIC packages as replacement to an existing ATECC508A and ATECC608A device familiesthat are currently available in DICE, WAFER, 3L CONTACT, 8L UDFN and 8L SOIC packages.Microchip has setup the ATECC508A and ATECC608A as �not recommended for new designs� onmicrochip.com. The newly launched ATECC608B is the recommended solution as it provides a few improvements.Pre Change:Device families ATECC508A and ATECC608A available in DICE, WAFER, 3L CONTACT, 8L UDFN and 8LSOIC packagesPost Change:Device families ATECC608B available in 3L CONTACT, 8L UDFN and 8L SOIC packagesChange Impact: NoneReason for Change: The ATECC608B provides its users with a chance to implement some enhancedfunctional security features to improve their overall system security and performance.Also, the new ATECC608B fixes a bug in the I2C performances present on both the ATECC508A andATECC608A occurring at low frequency when multiple devices are on the bus. It will improve physicalprotection against physical attacks.Change Implementation Status: In ProgressNew products availability date: *October 20, 2020 (date code: 2043) � For 3L CONTACT and 8L UDFNpackage*October 31, 2020 (date code: 2044) � For 8L SOIC package
PCN Status: Information notificationPCN Type: Manufacturing ChangeDescription of Change: Introduction of new ATECC608B device family available in 3L CONTACT, 8L UDFN and 8L SOIC packages as replacement to an existing ATECC508A and ATECC608A device families that are currently available in DICE, WAFER, 3L CONTACT, 8L UDFN and 8L SOIC packages.Microchip has setup the ATECC508A and ATECC608A as �not recommended for new designs� on microchip.com. The newly launched ATECC608B is the recommended solution as it provides a few improvements.Pre Change: Device families ATECC508A and ATECC608A available in DICE, WAFER, 3L CONTACT, 8L UDFN and 8L SOIC packagesPost Change:Device families ATECC608B available in 3L CONTACT, 8L UDFN and 8L SOIC packagesImpacts to Data Sheet: None. .Change Impact: None Reason for Change: The ATECC608B provides its users with a chance to implement some enhanced functional security features to improve their overall system security and performance.Also, the new ATECC608B fixes a bug in the I2C performances present on both the ATECC508A and ATECC608A occurring at low frequency when multiple devices are on the bus. It will improve physical protection against physical attacks.Change Implementation Status: In Progress New products availability date: *October 19, 2020 (date code: 2043) � For 3L CONTACT and 8L UDFN package *October 31, 2020 (date code: 2044) � For 8L SOIC package
PCN Status: Information notification Description of Change: Introduction of new ATECC608B device family available in 3L CONTACT, 8L UDFN and 8L SOIC packages as replacement to an existing ATECC508A and ATECC608A device families that are currently available in DICE, WAFER, 3L CONTACT, 8L UDFN and 8L SOIC packages. Microchip has setup the ATECC508A and ATECC608A as "not recommended for new designs " on microchip.com. The newly launched ATECC608B is the recommended solution as it provides a few improvements.Pre Change:Device families ATECC508A and ATECC608A available in DICE, WAFER, 3L CONTACT, 8L UDFN and 8L SOIC packagesPost Change:Device families ATECC608B available in 3L CONTACT, 8L UDFN and 8L SOIC packagesPre and Post Change Summary: See attachedImpacts to Data Sheet: None. Refer to this link for ATECC608B datasheet.Change Impact: NoneReason for Change: The ATECC608B provides its users with a chance to implement some enhanced functional security features to improve their overall system security and performance. Also, the new ATECC608B fixes a bug in the I2C performances present on both the ATECC508A and ATECC608A occurring at low frequency when multiple devices are on the bus. It will improve physical protection against physical attacks.Change Implementation Status: In ProgressNew products availability date: *October 19, 2020 (date code: 2043) � For 3L CONTACT and 8L UDFN package*October 31, 2020 (date code: 2044) � For 8L SOIC packageNote: See attachments section for the list of product availability per catalog part number in Affected_CPN list.Revision History: October 20, 2020: Issued Information notification. Attached is the qualification report and added new products availability date.
Part Status:
Microchip ATECC608A-SSHDA-T - Technical Attributes
| Frequency-Max: | 1MHz |
| Supply Voltage: | 2V to 5.5V |
| Data Bus Width: | 72b |
| Program Memory Type: | EEPROM |
| InterfaceType / Connectivity: | I2C |
| Operating Temp Range: | -40°C to +85°C |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
4000 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount