

Manufacturer Part #
ATTINY404-SSN
SAMPLE FPN ONLY - 20MHZ 4KB SOIC14 IND 105C GREEN
Microchip ATTINY404-SSN - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:14 November 2024 (date code: 2446)
***June 19, 2024: Reissued the initial notification to correct the typographical error in the Notification Subject***Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladiumcoated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Microchip has released a new Document for the ATtiny202/204/402/404/406 Silicon Errata and Data Sheet Clarification Documents of devices. If you are using one of these devices please read the document located at ATtiny202/204/402/404/406 Silicon Errata and Data Sheet Clarification Documents.ERRATA - ATtiny202/204/402/404/406 Silicon Errata and Data Sheet Clarification DocumentsNotification Status: FinalDescription of Change:• Document:– Editorial updates• Added new data sheet clarifications:– SPI:• 3.1.1. SPI Clock– Electrical Characteristics:• 3.2.1. Power Consumption. The Power Consumption in Power-Down (Max 25°C) reducedfrom 2 µA to 0.6 µA.• 3.2.3. SPI - Timing Characteristics• 3.2.4. Programming TimeImpacts to Data Sheet: NoneReason for Change: To improve productivity.Change Implementation Status: CompleteDate Document Changes Effective: 03 May 2024NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Revision History:June 8, 2023: Issued initial notification.September 16, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on October 30, 2023.Description of Change:Qualification of MTAI as a new final test site for selected ATTINY204-SSxx, ATTINY214-SSxx and ATTINY404-SSxx device families available in 14L SOIC (.150in) package.Reason for Change:To improve manufacturability by qualifying MTAI as a new final test site.
Description of Change:Qualification of CuPdAu as an additional bond wire material for selected ATTINY16xx, ATTINY4xx, ATTINY2xx, ATTINY8xx, ATTINY3224 and PIC16F1xxxx device families available in 14L SOIC (.150in) package assembled at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying CuPdAu as an additional bond wire material.
Part Status:
Available Packaging
Package Qty:
57 per Std. Mfr. Pkg