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Manufacturer Part #
BGA824N6E6329XTSA1
RF Amplifier RF MMIC SUB 3 GHZ
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| Mfr. Name: | Infineon | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:12000 per Reel Package Style:TSNP-6-2 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2539 | ||||||||||
Infineon BGA824N6E6329XTSA1 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Subject Introduction of new packing method affecting dedicated TSNP-6 package packed at JCET Group Co., Ltd. (Jiangyin, China).Reason Process enhancements to attain customer requirement.DescriptionDesiccant: Old - No, New - YesMoisture Barrier Bag: Old - No, New - YesPacking method: Old - No vacuum packing, New - Vacuum packedInner packing box dimension: Old - 185mm x 185mm x 19mm, New - 205mm x 200mm x 28mmOut packing box maximum quantity: Old - 132,000 pcs, New - 96,000 pcsIntended start of delivery 2025-09-30
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=BGA824N6E6329XTSA1&field4=Infineon&field18=https://p1na.futureelectronics.com/p/semiconductors--wireless-rf--rf-amplifiers--power-amplifiers/bga824n6e6329xtsa1-infineon-4203564
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=BGA824N6E6329XTSA1&field4=Infineon&field18=https://p1na.futureelectronics.com/p/semiconductors--wireless-rf--rf-amplifiers--power-amplifiers/bga824n6e6329xtsa1-infineon-4203564
Infineon BGA824N6E6329XTSA1 - Technical Attributes
| RF Type: | GPS |
| Frequency Range: | 1164MHz to 1615MHz |
| Supply Current: | 3.9mA |
| Supply Voltage: | 1.5V to 3.6V |
| P1dB: | -9dBm |
| Noise Figure: | 0.55dB |
| Gain: | 17dB |
| Power Dissipation: | 60mW |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -55°C to +150°C |
| Moisture Sensitivity Level: | 1 |
| Package Style: | TSNP-6-2 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
12000 per Reel
Package Style:
TSNP-6-2
Mounting Method:
Surface Mount