Manufacturer Part #
IC TXRX CAN 2.0 8MBPS - 8TDFN
Microchip has released a new Product Documents for the ATWINC15x0B-MU IEEE 802.11 b/g/n Network Controller SoC Data Sheet of devices.. Notification Status: FinalDescription of Change: 1) Document. Minor updates2) Section 2. Functional Overview- Updated pinout descriptions for various pins and added a note in 2.3 Pinout Description - Updated Pad width in 2.4 Package Description3) Section 3.2 Low-Power Oscillator. Added information software implementation requirement for 32.768 kHz clock4) Section 4.3 Nonvolatile Memory (eFuse). Updated contents and image5) Section 5.3 Radio - Updated frequency value from 2472 to 2484 GHz and added a note in Table 5-1 - Added a note for FW support of Short GI6) External Interfaces - Added 6.1 Interfacing with the Host Microcontroller - Removed I2C Slave Interface section 7) Power Management. Updated Figure 7-1 8) Electrical Specifications. Modified the following sections and regrouped them under Electrical Characteristics from other chapters: - 8.4 Current Consumption in Various Device States - 8.5.1 Receiver Performance - 8.5.2 Transmitter Performance - VDDIO Absolute Maximum Specification updated 9) Reference Design.- Updated Figure 9-1 - Updated Table 9-1 10) Design Consideration. Added new chapter 11) Table 12-1. Added new references to Errata Sheet, Reference Design Package, Deriving Application Gain Table Application Note and MCHPRT2 User GuideImpacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 14 Aug 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the MCP2542FD/4FD, MCP2542WFD/4WFD Data Sheet of devices. Notification Status: FinalDescription of Change: The following is the list of modifications: 1) Updated �Features� section. 2) Updated Section 1.0 �Device Overview�. 3) Updated Section 4.0 �Packaging Information�. 4) Updated Section �Product Identification System�.Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 14 Aug 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:1) Changed High-Level Input Voltage for MCP2544FD and MCP2544WFD from VIO-0.3 to VDD-0.3 in TABLE 2-1: “DC Characteristics”.2) Fixed SOIC package markings in Section 4.1 “Package Marking Information”.3) Clarified that MCP2544FD/4FD is a CAN FD Transceiver without WUP Option in Section “Product Identification System”.4) Minor typographical corrections.Reason for Change: To Improve ManufacturabilityDate Document Changes Effective: 25 Mar 2019
Revision History:February 12, 2018: Issued initial notification.June 26, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on July 26, 2018.Description of Change:Qualification of 8600 die attach and G700LTD mold compound for selected products available in 8L TDFN package at NSEB assembly site.Pre Change: Using 8200T die attach material and G770HCD molding compound material.Post Change: Using 8200T or 8600 die attach material and G770HCD or G700LTD molding compound material.Reason for Change:To improve manufacturability by qualifying G770HCD mold compound and 8600 die attach material.Estimated First Ship Date:July 26, 2018 (date code: 1830)