STMicroelectronics VD5xGx Advanced CMOS Image Sensors
Tailored for a wide range of uses including smart devices, computer vision, AR/VR, security, robotics and more
STMicroelectronics introduces a family of four advanced image sensors designed to address the diverse requirements of professional and consumer vision applications: VD55G0, VD55G1, VD56G3 and VD66GY. These sensors combine high performance, compact design, and low power consumption, making them ideal for a wide range of uses, including smart devices, computer vision, AR/VR, security, robotics and more.
The sensors in this family feature global shutter technology with high back-side illumination (BSI) performance, capturing images at high frame rates and resolutions. They excel in minimizing crosstalk and achieving high quantum efficiency (QE) in both visible and near infrared regions. This ensures outstanding image quality, even in challenging lighting conditions.
With tiny footprints, these sensors fit perfectly into size-constrained devices such as AR/VR glasses and personal electronics, without compromising on performance. Their clever design and comprehensive toolbox of on-chip functions make them ideal solutions for developing the next generation of smart and optimized systems.
Leveraging state-of-the-art technologies from STMicroelectronics' own foundry, these sensors are designed to capture bright and sharp color images, delivering high-quality results. They provide superior performance across various applications.
Ecosystem
STMicroelectronics has introduced a set of plug-and-play hardware kits, evaluation camera modules and software that ease development with its ST BrightSense global-shutter image sensors. All camera modules share a common FPC-to-board connector and pinout, allowing instant module changes and reuse across different lenses, colors, and image sensors in the ST BrightSense portfolio.
VD55G0
The VD55G0 is a 0.4 MP global shutter image sensor with high BSI performance which captures up to 210 frames per second in a 644 x 604 resolution format.
The pixel construction of this device minimizes crosstalk while enabling a high quantum efficiency (QE) in the near infrared spectrum.
Features - Global shutter technology
- STMicroelectronics proprietary single-layer 3D stacked sensor (40 nm / 65 nm)
- 2.61 µm x 2.61 µm BSI pixel with full CDTI (capacitive deep trench)
- High performance imaging
- Excellent QE (quantum efficiency)
- High MTF (modulation transfer function) up to near IR
- Perfect PLS (shutter efficiency)
- Compact sensor design
- Smallest sensor on the market
- Compact die size: 2.6 mm x 2.5 mm
- 640 pixel x 600 pixel resolution
- Very small pixel array: 1.67 mm x 1.57 mm
- Optical format: between 1/9 inch
- Operating range
- Junction temperature: -30°C to 85°C
- Interfaces
- Single lane transmitter MIPI CSI-2 (version 1.3)
- 1.2 Gbps per lane
- © 2005–2010 MIPI Alliance, Inc.
- Fast mode+ I²C control interface
| - Integrated features
- Temperature sensor
- Up to 210 fps at full resolution
- Up to 260 fps at VGA resolution
- Programmable 4-frame context sequences
- Automatic dark calibration
- Dynamic defective correction
- Embedded auto-exposure
- Flexible I/O and control
- 4 multifunction I/Os
- Dynamically programmable with frame contexts (GPIO, strobe pulse, PWM, V sync)
- Up to 4 illumination control outputs
- Synchronized with sensor integration periods
- Configurable for leader/follower external frame start
- Advanced imaging capabilities
- Mirror/flip readout
- Fully sequenceable with frame contexts
- Cropping
- Binning (x2 and x4)
- Analog binning:
- 320x240 @ 500 fps
- 320x252 @ 480 fps
- 320x300 @ 414 fps
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VD55G1
The VD55G1 is a unique ultracompact and low-power 0.6 MP image sensor in the ST BrightSense portfolio. It has been developed to enable the next generation of smart and power-efficient systems. Leveraging the world’s first 2.16 µm global shutter pixel, the sensor highlights maximum compactness.
Features - Tiny sensor, which can fit everywhere:
- World’s first 2.16 µm global shutter pixel for optimum compactness
- Footprint of only 2.73 x 2.16 mm²
- Small optical format of 1/9 inch (800 x 700) and 1/10 inch (600 x 600)
- Ultralow power solution with:
- Smart auto wake-up feature, with ultralow power sleepy mode, and smart wake up when an event is detected
- Low power operation of ≤ 2 mW in auto wake-up mode
- Power consumption scaling with features, frame rate, and software standby
| - Optimized image quality straight out of the sensor with:
- Cutting-edge performance of ST proprietary pixels combining global shutter, BSI, CDTI, and 3D stacking
- High sensitivity and sharpness in both visible and NIR
- Various on-chip features to optimize image quality, such as autoexposure, noise reduction, or defect correction
- Seamless integration into embedded systems:
- 1-lane MIPI CSI-2 output
- I²C and I3C control interface
- Effortless integration with VD55G1 development kit, camera modules, with drivers available from st.com
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VD56G3
The VD56G3 is a compact 1.53 MP monochrome global shutter image sensor with enhanced sensitivity and sharpness for accurate image capture.
Features - Cutting-edge performance of ST proprietary pixel:
- BSI structure provides superior QE, MTF, and angular response.
- Full DTI technology further increases sensitivity and sharpness.
- Benefits both visible and NIR imaging (850 nm and 940 nm).
- Proprietary technology from ST foundry in France, ensuring safe supply.
- Easy integration into your system:
- Ultracompact die with a centered design to minimize your system size.
- Small optical format: 4.6 mm (1/4'') at full resolution and 3.7 mm (1/5'') with 1 MP crop.
- Low power, ideal for battery-powered devices.
- Robust design and image quality in temperature.
| - A complete toolbox of in-sensor features:
- Stunning images with in-sensor autoexposure and various corrections.
- Multiple features to optimize data size and frame rates such as crop, binning, and programmable sequences.
- 8 GPIOs enabling extra controls such as trigger or LED synchronization.
- Seamless connection to embedded processing platforms:
- 1 or 2 lanes MIPI CSI-2 interface enabling straight connection to entry-level cost-effective processing platforms.
- Start immediately your development with our turnkey sensor boards, modules, and drivers for the VD56G3 image sensor.
- The VD56G3 monochrome image sensor is also available in color RGB (VD66GZ) and RGB-NIR versions (VD16GZ).
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VD66GY
The VD66GY is a compact 1.53 MP RGB global shutter image sensor with enhanced sensitivity and sharpness for accurate image capture.
Features - Cutting-edge performance of ST proprietary pixel:
- BSI structure provides superior QE, MTF, and angular response.
- Full DTI technology further increases sensitivity and sharpness.
- Excellent response across the whole color spectrum.
- Proprietary technology from ST foundry in France, ensuring safe supply.
- Easy integration into your system:
- Ultracompact die with centered design to minimize your system size.
- Small optical format: 4.6 mm (1/4'') at full resolution and 3.7 mm (1/5'') with 1 MP crop.
- Low power, ideal for battery-powered devices.
- Robust design and image quality in temperature.
| - A complete toolbox of in-sensor features:
- Stunning images with in-sensor autoexposure and various corrections.
- Multiple features to optimize data size and frame rates such as crop, binning, and programmable sequences.
- 8 GPIOs enabling extra controls such as trigger or LED synchronization.
- Seamless connection to embedded processing platforms:
- 1 or 2 lanes MIPI CSI-2 interface enabling straight connection to entry-level cost-effective processing platforms.
- Start immediately your development with our turnkey sensor boards, modules, and drivers for the VD66GY image sensor.
- The VD66GY color image sensor is also available in monochrome (VD56G3) and RGB-NIR versions (VD16GZ).
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