TE Connectivity’s (TE) main memory connectors are made to JEDEC industry standards for Dual Inline Memory Modules (DIMM) and Small Outline DIMM (SO DIMM). TE also supplies custom memory modules for computing, storage and communications equipment.
The TE memory socket portfolio covers the DDR2, DDR3 and DDR4 generations of sockets. Each product family consists of vertical, right-angle and other angled configurations in solder tail and surface-mount options. The high-quality contact design in these connectors protects against module stubbing.
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TE: Solder tail and surface-mount options
