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TE Connectivity

 

TE Connectivity’s (TE) main memory connectors are made to JEDEC industry standards for Dual Inline Memory Modules (DIMM) and Small Outline DIMM (SO DIMM). TE also supplies custom memory modules for computing, storage and communications equipment.

The TE memory socket portfolio covers the DDR2, DDR3 and DDR4 generations of sockets. Each product family consists of vertical, right-angle and other angled configurations in solder tail and surface-mount options. The high-quality contact design in these connectors protects against module stubbing.

Features
  • Designed to JEDEC industry standards for new and existing DIMM memory modules
  • End latches for module retention, ejection and mechanical voltage keying
  • SO DIMM sockets offered in several stacking heights
Applications
  • Servers
  • High-performance computing equipment
  • Workstations
  • Mass storage devices
  • Communications equipment
  • Desktop PCs
  • Instrumentation

 

TE: Solder tail and surface-mount options

 

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