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Référence fabricant
MCP6004-E/SL
MCP6004 Series 6 V 1 MHz SMT Low-Power Operational Amplifier - SOIC-14
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :57 par Tube Style d'emballage :SOIC-14 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 1909 | ||||||||||
Microchip MCP6004-E/SL - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP6004-E/SL&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--analog--amplifiers--general-purpose/mcp6004-e-sl-microchip-7362007
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP6004-E/SL&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--analog--amplifiers--general-purpose/mcp6004-e-sl-microchip-7362007
Microchip MCP6004-E/SL - Caractéristiques techniques
| No of Channels: | 4 |
| Slew Rate-Nom: | 0.6V/µs |
| Input Offset Voltage-Max: | 4.5mV |
| Style d'emballage : | SOIC-14 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
This family operates from a single supply voltage as low as 1.8 V, while drawing 100 µA (typ.) quiescent current. Additionally, the MCP6001 supports rail-to-rail input and output swing, with a common mode input voltage range of VDD + 300 mV to VSS – 300 mV. This family of op amps is designed with Microchip’s
advanced CMOS process.
Features:
- Available in SC-70-5 and SOT-23-5 packages
- Gain Bandwidth Product: 1 MHz (typ.)
- Rail-to-Rail Input/Output
- Supply Voltage: 1.8 V to 5.5 V
- Supply Current: IQ = 100 µA (typ.)
- Phase Margin: 90° (typ.)
- Temperature Range:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
- Available in Single, Dual and Quad Packages
Applications:
- Automotive
- Portable Equipment
- Photodiode Amplifier
- Analog Filters
- Notebooks and PDAs
- Battery-Powered Systems
View the complete family of MCP6004 product family
Emballages disponibles
Qté d'emballage(s) :
57 par Tube
Style d'emballage :
SOIC-14
Méthode de montage :
Surface Mount
