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Référence fabricant
TC7660SCOA713
TC7660 Series 1.5 to 12 Vin Surge Charge Pump DC-DC Converter - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3300 par Reel Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip TC7660SCOA713 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
***UPDATE OF PCN110995, PCN111020, PCN116766***Revision History: February 20, 2025: Issued initial notification.February 21, 2025: Re-issued initial notification to update the qualification plan. October 17, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on November 20, 2025. October 23, 2025: Re-issued final notification to update pre and post change table to "wafer size". Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for TC7107, TC7107A, TC7106, TC7106A, TC7660, TC1044S, TC623, TC682, TC7116, TC514, TC7662B, TC7117, TC510, TC4431, TC4432, TC624, TC7117A, TC7116A, TC7660S, TC7129 and TC7660H device families of 40K and 42K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated First Ship Date: 20 November 2025 (date code: 2547)
***UPDATE OF PCN110995 & PCN111020***Revision History: February 20, 2025: Issued initial notification.February 21, 2025: Re-issued initial notification to update the qualification plan. October 17, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on November 20, 2025. Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for TC7107, TC7107A, TC7106, TC7106A, TC7660, TC1044S, TC623, TC682, TC7116, TC514, TC7662B, TC7117, TC510, TC4431, TC4432, TC624, TC7117A, TC7116A, TC7660S, TC7129 and TC7660H device families of 40K and 42K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiry.Estimated First Ship Date: 20 November 2025 (date code: 2547)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for TC7107, TC7107A, TC7106, TC7106A, TC7660, TC1044S, TC623, TC682, TC7116, TC514, TC7662B, TC7117, TC510, TC4431, TC4432, TC624, TC7117A, TC7116A, TC7660S, TC7129 and TC7660H device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file calledTempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: August 2025Revision History: February 20, 2025: Issued initial notification.February 21, 2025: Re-issued initial notification to update the qualification plan.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for TC7107, TC7107A, TC7106, TC7106A, TC7660, TC1044S, TC623, TC682, TC7116, TC514, TC7662B, TC7117, TC510, TC4431, TC4432, TC624, TC7117A, TC7116A, TC7660S, TC7129 and TC7660H device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Microchip has released a new Datasheet for the TC7660S Super Charge Pump DC-to-DC Voltage Converter Data Sheet of devices.Description of Change: • Added Automotive Qualification to Features and examples in Product Identification System. • Added values for ESD protection to Absolute Maximum Ratings†. • Updated Section 6.0, Packaging Information. • Made minor text and format changes throughout the document.Reason for Change: To Improve Productivity
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TC7660SCOA713&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--analog--regulators-reference--switching-regulators/tc7660scoa713-microchip-2003240
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TC7660SCOA713&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--analog--regulators-reference--switching-regulators/tc7660scoa713-microchip-2003240
Microchip TC7660SCOA713 - Caractéristiques techniques
| Output Current-Max: | 20mA |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The TC7660SCOA713 is a Surge Charge Pump DC-to-DC Converter, that converts a +1.5 V to +12 V input to a corresponding -1.5 V to -12 V output using only two low-cost capacitors. Available in SOIC-8 surface mount package.
Features:
- Oscillator boost from 10kHz to 45kHz
- Converts +5V Logic Supply to ±5V System
- Wide Input Voltage Range 1.5V to 12V
- Efficient Voltage Conversion 99.9%
- Excellent Power Efficiency 98%
- Low Power Supply 80μA @ 5 VIN
- Low Cost and Easy to Use
- Only Two External Capacitors Required
- Available in Small Outline (SOIC) Package
- Improved ESD Protection Up to 10kV
- No External Diode Required for High Voltage Operation
Emballages disponibles
Qté d'emballage(s) :
3300 par Reel
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount