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Manufacturer Part #
PIC24FJ256DA210-I/PT
PIC24 Series 96 kB RAM 256 kB Flash 16-Bit Microcontroller SMT - TQFP-100
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:119 per Tray Package Style:TQFP-100 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2518 | ||||||||||
Microchip PIC24FJ256DA210-I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for selected DSPIC33xx, PIC24EPxx, PIC32MXxx, PIC24FJxx, and PIC18F9xx device families available in 100L TQFP (12x12x1mm) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:15 January 2025 (date code: 253)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for selected DSPIC33xx, PIC24EPxx, PIC32MXxx, PIC24FJxx, and PIC18F9xx device families available in 100L TQFP (12x12x1mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Final Notice: Qualification of 100L TQFP (12x12x1mm) with 240x240 Lead-Frame Paddle size at ASAC (UDG) assembly site. Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI and ASAC assembly sites.Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC24FJ256DA210-I/PT&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--microcontrollers--16-bit-general-purpose/pic24fj256da210-i-pt-microchip-9000398
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC24FJ256DA210-I/PT&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--microcontrollers--16-bit-general-purpose/pic24fj256da210-i-pt-microchip-9000398
Microchip PIC24FJ256DA210-I/PT - Technical Attributes
| Family Name: | PIC24F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 256kB |
| RAM Size: | 98kB |
| Speed: | 32MHz |
| No of I/O Lines: | 84 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USB |
| Peripherals: | Analog Comparators/I2C/On-Chip-ADC/PWM/SPI/UART/USB/Watchdog |
| Number Of Timers: | 5 |
| Supply Voltage: | 2.2V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 24-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-100 |
| Mounting Method: | Surface Mount |
Features & Applications
Microchip provides solutions for the entire performance range of 8-bit, 16-bit, and 32-bit microcontrollers, with a powerful architecture, flexible memory technologies, comprehensive easy-to-use development tools, complete technical documentation and post design-in support through a global sales and distribution network.16-bit PIC Microcontrollers & dsPIC Digital Signal Controllers. Microchip offers two 16-bit Microcontroller (MCU) families plus two 16-bit Digital Signal Controller (DSC) families that give you compatible options across a wide spectrum of price, performance and feature sets.
This is Ideal for Graphical interface applications that can benefit from the integrated Graphics, 24 K byte RAM for frame buffer, mTouch, USB and other peripherals.
PIC24FJ256DA210-I/PTis part of the PIC24F Series family with 256 kB Flash as a 16-Bit Flash Microcontroller.It can sustain standard temperature ranges from -40 to 125 and has 100 pin in a TQFP package. This device is lead free.
Features:
- Graphics Controller Features:
- 3x Graphics Hardware Acceleration Units.
- Color Look-up Table (CLUT) with Maximum of 256 Entries.
- Direct Interface to Monochrome, C-STN, TFT, OLED.
- Resolution up to 640x480 30 Hz, 16 bpp, or 480x272 60 Hz, 16 bpp.
- Universal Serial Bus Features:
- USB v2.0 On-The-Go (OTG) Compliant.
- Dual Role Capable – Can act as either Host or Peripheral.
- Low-Speed (1.5 Mbps) and Full-Speed (12 Mbps) USB Operation in Host mode.
- Full-Speed USB Operation in Device mode.
- Analog Features:
- Up to 24x, Capacitive touch sensing.
- Up to 24x, 10-Bit, ADC at 500 ksps.
- 3x Analog Comparators with Programmable Input/Output Configuration.
- Power Management:
- On-Chip Voltage Regulator of 1.8 V.
- Switch between Clock Sources in Real Time.
- Idle, Sleep and Doze modes with Fast Wake-up and Two-Speed Start-up.
- Run Mode: 800 uA/MIPS, 3.3 V Typical.
- Sleep mode Current Down to 20 uA, 3.3 V Typical.
- Standby Current with 32 kHz Oscillator: 22 uA, 3.3 V Typical.
Available Packaging
Package Qty:
119 per Tray
Package Style:
TQFP-100
Mounting Method:
Surface Mount
