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Manufacturer Part #
PIC18F14K22-I/ML
PIC18F Series 16 kB Flash 512 B RAM 64 MHz 8-Bit Microcontroller - QFN-20
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:91 per Tube Package Style:QFN-20 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2336 | ||||||||||
Microchip PIC18F14K22-I/ML - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Qualification of MPHL as an additional final test site for selected PIC16F1619, PIC16F1829, PIC16F1507, PIC16F1508, PIC16F1709, PIC16LF1559, PIC16F18044, PIC16F18045, PIC18F14K22, PIC18F13K22, PIC16F1828, PIC16F1618, PIC16F1509, PIC16F1708, PIC16F721, PIC16F18046, PIC16LF1828, PIC16LF1829 and PIC16F720 device families available in 20L QFN (4x4x0.9mm) package.Pre and Post Summary Changes: See attached documentImpacts to Datasheet: NoneChange Impact: NoneReason for Change:To improve productivity and on-time delivery performance by qualifying MPHL as an additional final test site.Change Implementation Status: In ProgressEstimated First Ship Date:09 August 2025 (date code: 2532)Note: Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Timetable Summary: See attached document
Description of Change: This qualification was initially performed to qualify Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 16L, 20L and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change: Microchip has decided to not qualify Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 16L, 20L and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.November 06, 2023: Issued initial notification.March 08, 2024: Reissued initial notification. Updated the affected parts list. Updated the mold compound from CEL-400ZHF40-PLM2KG to X8511AU-IMP1 (1st mold) / X8511CUB-AP1 (2nd mold), and EME-QXG01 (1st & 2nd mold), and updated die attach from BSP 140 to BSP 1100 in the pre- and post- change summary table. Updated the estimated qualification completion date to be on March 2024.March 15, 2024: Reissued initial notification to update the Qual Plan file name.April 16, 2024: Issued final notification. Added estimated first ship date on May 01, 2024 and updated qual report completion on May 31, 2024. Updated the affected CPN list to add newly released parts. Updated post change mold compound material to NEPL Proprietary.December 10, 2024: Re-issued final notification. Attached the qualification report. Updated the affected CPN list to add newly released parts. Removed CPNs PIC18F16Q20-I/REBC01 and PIC18F16Q20TI/REBC01 on the affected parts list due to being EOL'd. Removed 16L QFN (4x4x0.9mm) package and included 20L VQFN (4x4x1.0mm) package in the Notification subject.March 12, 2025: Issued cancellation notice.
PCN Status:Final NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 16L, 20L and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change:To improve Productivity, Manufacturability, and Cycle Time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:01 May 2024 (date code: 2418)
Revision History:November 06, 2023: Issued initial notification.March 08, 2024: Reissued initial notification. Updated the affected parts list. Updated the mold compound from CEL-400ZHF40-PLM2KG to X8511AU-IMP1 (1st mold) / X8511CUB-AP1 (2nd mold), and EME-QXG01 (1st & 2nd mold), and updated die attach from BSP 140 to BSP 1100 in the pre- and post- change summary table. Updated the estimated qualification completion date to be on March 2024.March 15, 2024: Reissued initial notification to update the Qual Plan file name.April 16, 2024: Issued final notification. Added estimated first ship date on May 01, 2024 and updated qual report completion on May 31, 2024. Updated the affected CPN list to add newly released parts. Updated post change mold compound material to NEPL Proprietary.Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 16L and 20L QFN (4x4x0.9mm), 16L and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change:To improve Productivity, Manufacturability, and Cycle Time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 16L QFN and 20L QFN (4x4x0.9mm), 16L VQFN and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L QFN and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change:To improve Productivity, Manufacturability, and Cycle Time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 16L QFN and 20L QFN (4x4x0.9mm), 16L VQFN and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L QFN and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change:To improve Productivity, Manufacturability, and Cycle Time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC18F14K22-I/ML&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--microcontrollers--8-bit/pic18f14k22-i-ml-microchip-7061757
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC18F14K22-I/ML&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--microcontrollers--8-bit/pic18f14k22-i-ml-microchip-7061757
Microchip PIC18F14K22-I/ML - Technical Attributes
| Family Name: | PIC18 |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 16kB |
| RAM Size: | 512B |
| Speed: | 64MHz |
| No of I/O Lines: | 20 |
| InterfaceType / Connectivity: | I2C/SPI/USART |
| Peripherals: | Analog Comparators/I2C/On-Chip-ADC/PWM/SPI/USART/Watchdog |
| Number Of Timers: | 4 |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 12-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | QFN-20 |
| Mounting Method: | Surface Mount |
Features & Applications
PIC18F1XK22 family devices offer all of the advantages of the well recognized PIC18F High Performance MCUs; 8-bit, C compiler optimized architecture and an industry leading peripheral set now available in a low pin-count option. These new 20-pin products include a 16 MHz precision Internal Oscillator which can be used with the standard 4X PLL to produce 16 MIPS of performance (64 MHz @ 3 V). Standard analog peripherals include 12 channels of 10-bit A/D, Dual Rail-Rail Comparators with improved input/output multiplexing and an on-chip selectable Fixed Voltage Reference.
Features:
- C Compiler optimized architecture
- 256 bytes data EEPROM
- Linear program memory addressing to 16 Kbytes
- Linear data memory addressing to 512 bytes
- Extreme Low-Power Management
- PIC18LF1XK22 with nanoWatt XLP™ Technology
- Sleep mode: 50 nA, typical
- Watchdog Timer: 600 nA, typical
- Two-Speed Oscillator Start-up
- Operating voltage 1.8 V- 5.5 V
- Self-reprogrammable under software control
- Power-on Reset (POR), Power-up Timer (PWRT) and
- Oscillator Start-up Timer (OST)
- Programmable Brown-out Reset (BOR)
- Extended Watchdog Timer (WDT) with on-chip oscillator and software enable
- Enhanced Capture/Compare/PWM (ECCP) module with
Available Packaging
Package Qty:
91 per Tube
Package Style:
QFN-20
Mounting Method:
Surface Mount