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Manufacturer Part #
PIC18F47K42-I/ML
PIC PIC® XLP™ 18K Microcontroller IC 8-Bit 64MHz 128KB (64K x 16) FLASH 44-QFN (
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:45 per Tube Package Style:QFN-44 Mounting Method:Surface Mount | ||||||||||
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Microchip PIC18F47K42-I/ML - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected PIC16F15344, PIC16F1535x, PIC16F1537x, PIC16F18346, PIC16F1885x, PIC16F1887x, PIC16F1919x, PIC18F24K4x, PIC18F25K4x, PIC18F25K83, PIC18F26K4x, PIC18F26K83, PIC18F27K4x, PIC18F45K4x, PIC18F46K4x, PIC18F47K4x, PIC18F65K40, PIC18F66K40 and PIC18F67K40 device families available in various packages assembled at MTAI.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material and QMI519 as a new die attach material assembled at MTAI.Estimated First Ship Date: 05 August 2025 (date code: 2532)
Microchip has released a new Errata for the PIC18(L)F27/47/57K42 Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at PIC18(L)F27/47/57K42 Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change: Updated Module 1.2 Minimum VDD Specification for silicon revision A3.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity
Revision History: May 18, 2022: Updated affected parts list.Microchip has released a new Product Documents for the PIC18(L)F27/47/57K42 Family Silicon Errata and Data Sheet Clarification of devices.Description of Change: Added Module 3.3 Double Sample Conversions, 12 Central Processing Unit (CPU), and 12.1 FSR Shadow Registers.. Reason for Change: To Improve Productivity
Description of Change: - Added Module 3.3 Double Sample Conversions, 12 Central Processing Unit (CPU), and 12.1 FSR Shadow Registers..Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 2 May 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Microchip PIC18F47K42-I/ML - Technical Attributes
| Family Name: | PIC18F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| RAM Size: | 8kB |
| Speed: | 64MHz |
| No of I/O Lines: | 36 |
| InterfaceType / Connectivity: | I2C/SPI/UART |
| Peripherals: | BOR/POR/PWM |
| Number Of Timers: | 8 |
| Supply Voltage: | 2.3V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 35-chx12-bit |
| On-Chip DAC: | 1-chx5-bit |
| Watchdog Timers: | 1 |
| Package Style: | QFN-44 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
45 per Tube
Package Style:
QFN-44
Mounting Method:
Surface Mount