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Manufacturer Part #
BGA725L6E6327FTSA1
BGA725L6 1.5 to 3.6 V 0.65 dB SMT Front End Low Noise Amplifier - TSLP-6-2
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| Mfr. Name: | Infineon | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:15000 per Reel Mounting Method:Surface Mount |
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Infineon BGA725L6E6327FTSA1 - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
***UPDATE to Future PCN114683***SPCN# 2025-001-ADelta to previous revision:Additional affected product BGA 725L6Description:Current wafer bumping location at Amkor Advanced Technology Taiwan Inc. will be discontinued. Qualified wafer bumping location at Amkor Assembly & Test (Shanghai) Co., Ltd. will be introduced.Reason:Infineon?s partner, Amkor Taiwan, announced discontinuation of 200 mm wafer bumping plant by end of 2025.The wafer bumping of the affected products will be transferred to Amkor China, to assure continuity of supply.Intended start of delivery 2026-01-31
Part Status:
-
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Infineon BGA725L6E6327FTSA1 - Technical Attributes
| Supply Voltage: | 1.5V to 3.6V |
| Supply Current: | 3.6mA |
| P1dB: | -15dBm |
| Noise Figure: | 0.65dB |
| Gain: | 20dB |
| Frequency Range: | 1550MHz to 1615MHz |
| Power Dissipation: | 72mW |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| No of Terminals: | 6 |
| Moisture Sensitivity Level: | 1 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
15000 per Reel
Mounting Method:
Surface Mount