Référence fabricant
BGA725L6E6327FTSA1
BGA725L6 1.5 to 3.6 V 0.65 dB SMT Front End Low Noise Amplifier - TSLP-6-2
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| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :15000 par Reel Méthode de montage :Surface Mount |
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Infineon BGA725L6E6327FTSA1 - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
***UPDATE to Future PCN114683***SPCN# 2025-001-ADelta to previous revision:Additional affected product BGA 725L6Description:Current wafer bumping location at Amkor Advanced Technology Taiwan Inc. will be discontinued. Qualified wafer bumping location at Amkor Assembly & Test (Shanghai) Co., Ltd. will be introduced.Reason:Infineon?s partner, Amkor Taiwan, announced discontinuation of 200 mm wafer bumping plant by end of 2025.The wafer bumping of the affected products will be transferred to Amkor China, to assure continuity of supply.Intended start of delivery 2026-01-31
Statut du produit:
Infineon BGA725L6E6327FTSA1 - Caractéristiques techniques
| Supply Voltage: | 1.5V to 3.6V |
| Supply Current: | 3.6mA |
| P1dB: | -15dBm |
| Noise Figure: | 0.65dB |
| Gain: | 20dB |
| Frequency Range: | 1550MHz to 1615MHz |
| Power Dissipation: | 72mW |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| No of Terminals: | 6 |
| Moisture Sensitivity Level: | 1 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
15000 par Reel
Méthode de montage :
Surface Mount