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Manufacturer Part #
MCP1725-5002E/SN
500MA CMOS LDO, VOUT=5.0V, EXTENDED TEMP RANGE
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP1725-5002E/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 112912 ***Revision History: March 07, 2025: Issued initial notification.March 10, 2025: Re-issued initial notification to update the Qualification Plan file.May 14, 2025: Re-issued the initial notification to update the test name from 'Q100' to 'DLT' and to increase the number of lots from '1' to '3' for ELFR, DLT, and Electrical Distribution tests in the Qual Plan.November 11, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 10, 2025. Updated affected parts list to add MCP1824ST1202E/DBVAO, MCP1824T1802E/OTVAO, MCP1825S-5002E/DBVAO and MCP1725-5002E/SNVAO catalog part numbers (CPN). Added a new column titled 'Change (Yes/No)' to the Pre and Post Change Summary table.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families of 132k and 133k technologies available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 10 December 2025 (date code: 2550)
******FPCN111387 UPDATE/LOCATION CHANGE******Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.**March 10, 2025: Re-issued initial notification to update the Qualification Plan file.**May 14, 2025: Re-issued the initial notification to update the test name from 'Q100' to 'DLT' and to increase the number of lots from '1' to '3' for ELFR, DLT, and Electrical Distribution tests in the Qual Plan.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP1725-5002E/SN&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--analog--regulators-reference--linear-regulators/mcp1725-5002e-sn-microchip-8200701
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP1725-5002E/SN&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--analog--regulators-reference--linear-regulators/mcp1725-5002e-sn-microchip-8200701
Microchip MCP1725-5002E/SN - Technical Attributes
| Input Voltage-Min: | 2.3V |
| Input Voltage-Max: | 6V |
| Output Voltage Fixed: | 5V |
| Dropout Voltage-Max: | 350mV |
| Output Current-Max: | 500mA |
| Rated Power: | 0.766W |
| Tolerance (%): | ±0.5% |
| Operating Temp Range: | -40°C to +125°C |
| Regulator Topology: | Fixed |
| Quiescent Current: | 220µA |
| No. of Outputs: | Single |
| Output Noise: | 2µV |
| Load Regulation (%): | 1% |
| Line Regulation (%): | 0.16% |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP1725 series of 500 mA Low Dropout (LDO) linear regulator that provides high current and low output voltages in a very small package. The MCP1725 comes in a fixed (or adjustable) output voltage version, with an output voltage range of 0.8 V to 5. 0 V.
The 500 mA output current capability, combined with the low output voltage capability, make the MCP1725 a good choice for new sub-1.8 V output voltage LDO applications that have high current demands. The MCP1725 is stable using ceramic output capacitors that inherently provide lower output noise and reduce the size and cost of the entire regulator solution. Only 1 μF of output capacitance is needed to stabilize the LDO.
Features:
- Up to 500 mA output load current
- Low dropout voltage: 210 mV typical at 500 mA
- Output voltage from 0.8 V to 5.0 V, both fixed and adjustable
- Stable with 1.0 µF ceramic output capacitor
- Power good output with adjustable delay
- Low supply current: 120 µA (typ)
- Low shutdown current: 0.1 µA (typ)
- DFN-8 2x3 and SOIC-8 Pb-free packages
Applications:
- High-Speed Driver Chipset Power
- Networking Backplane Cards
- Notebook Computers
- Network Interface Cards
- Palmtop Computers
- Video Graphics Adapters
- 2.5 V to 1.X V Regulators
Available Packaging
Package Qty:
100 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount
