Free shipping over $100 USD. Conditions apply
Manufacturer Part #
IXFH22N60P3
MOSFET DISCRETE
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Littelfuse | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:30 per Tube | ||||||||||
| Date Code: | |||||||||||
Littelfuse IXFH22N60P3 - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN105537 UPDATE/MULITIPLE CHANGE****Description of Change:This PCN is a revised version of the previously issued PCN LFPCN-DMI-BTA-2024-001/01, dated May 13, 2024, which informed you of an additional backend manufacturing site for the discrete MOSFET and IGBT parts. This updated version includes change in lead finish.1. Addition of in-house assembly line in Lipa as a new supplier and alternative source for TO-247-3L, TO-247HV, PLUS247, PLUS TO-247HV (PLUS247HV), ISO247 and ISOPLUS247 packages. This will further streamline and enhance our supply chain efficiencies.2. Change in device marking3. Change in inner box and tube labels, and tube dimensions: 4. Change in lead finish*New country of origin: Philippines
DESCRIPTION OF CHANGE:Qualification of the new alternative EMC, free of dechlorane plus, for the affected discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP).The new alternative EMC has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B.Reason:In preparation for the upcoming ban on dechlorane plus by the European Commission (Stockholm Convention), Littelfuse has qualified an alternative epoxy molding compound (EMC), free of dechlorane plus, for the affected discrete MOSFET, IGBT, multichip and bipolar parts listed under appendix B.
Addition of new alternative epoxy molding compound for discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP). The new alternative epoxy molding compound has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B.
SUBJECT: Assembled Device Marking Format Changes and Outer Box/Bag Label Format Changes - Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. See attached for more details - Change to the box label format: The paper sticker label found on the outer box or bag will see a format change that incorporates the Littelfuse logo along with the IXYS logo. The printed information remains the same (PN, Qty, Lot #, date code, country of origin). The change allows for a improved readability. This change does not affect the form, fit or function of the product. REMARKS: This changes from the original IXYS Corporation marking/labeling format to the new IXYS LLC-USA format is being done to conform to the SAP product management system requirements of our parent company Littelfuse Corporation.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=EU&field16=en&field2=IXFH22N60P3&field4=Littelfuse&field18=https://p1emea.futureelectronics.com/es/p/semiconductors--discretes--transistors--mosfets/ixfh22n60p3-littelfuse-3148514
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=EU&field16=en&field2=IXFH22N60P3&field4=Littelfuse&field18=https://p1emea.futureelectronics.com/es/p/semiconductors--discretes--transistors--mosfets/ixfh22n60p3-littelfuse-3148514
Available Packaging
Package Qty:
30 per Tube