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Référence fabricant
PIC16F15224-I/SL
8BIT 7KB FLASH 14SOIC 512B RAM, 10b ADC, 2x PWM, 2x CCP, HLT, WDT, PPS, EUSART,
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :57 par Tube Style d'emballage :SOIC-14 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip PIC16F15224-I/SL - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:14 November 2024 (date code: 2446)
***June 19, 2024: Reissued the initial notification to correct the typographical error in the Notification Subject***Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladiumcoated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Description of Change:Qualification of CuPdAu as an additional bond wire material for selected ATTINY16xx, ATTINY4xx, ATTINY2xx, ATTINY8xx, ATTINY3224 and PIC16F1xxxx device families available in 14L SOIC (.150in) package assembled at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying CuPdAu as an additional bond wire material.
Microchip has released a new Errata for the PIC16F15213/14/23/24/43/44 Silicon Errata and Data Sheet Clarifications of devices.Description of Change: Added silicon revision A8.Reason for Change: To Improve ProductivityDate Document Changes Effective: 28 Sep 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Errata for the PIC16F15213/14/23/24/43/44 Silicon Errata and Data Sheet Clarifications of devices.Description of Change: Added silicon errata item 1.7.1.Reason for Change: To Improve Productivity Date Document Changes Effective: 05 Sep 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=PIC16F15224-I/SL&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/es/p/semiconductors--microcontrollers--8-bit/pic16f15224-i-sl-microchip-8135270
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=PIC16F15224-I/SL&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/es/p/semiconductors--microcontrollers--8-bit/pic16f15224-i-sl-microchip-8135270
Microchip PIC16F15224-I/SL - Caractéristiques techniques
| Family Name: | PIC16F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 7kB |
| RAM Size: | 512B |
| Speed: | 32MHz |
| No of I/O Lines: | 11 |
| InterfaceType / Connectivity: | I2C/LINbus/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 11-chx10-bit |
| Style d'emballage : | SOIC-14 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
57 par Tube
Style d'emballage :
SOIC-14
Méthode de montage :
Surface Mount