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Référence fabricant
MCP1703T-3002E/MC
LOW Iq, High Vin LDO
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3300 par Reel | ||||||||||
| Code de date: | |||||||||||
Microchip MCP1703T-3002E/MC - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP1702, MCP1703 and MCP1703A device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Microchip has released a new Datasheet for the MCP1703 - 250 mA, 16V, Low Quiescent Current LDO of devices.Notification Status: FinalDescription of Change: Revision includes:• Added automotive qualification to Features and examples to Product Identification System.• Made minor corrections.• Updated Section 7.0 “Packaging Information” and Product Identification System.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 14 Sep 2022
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP1703T-3002E/MC&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--voltage-references/mcp1703t-3002e-mc-microchip-5014686
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP1703T-3002E/MC&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--voltage-references/mcp1703t-3002e-mc-microchip-5014686
Emballages disponibles
Qté d'emballage(s) :
3300 par Reel