Référence fabricant
25LC020A-I/SN
25LC020A Series 2 Kbit (256 x 8) 5.5 V SMT SPI Bus Serial EEPROM - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tube Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2138 | ||||||||||
Microchip 25LC020A-I/SN - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Microchip has released a new Product Documents for the 25AA020A/25LC020A 2-Kbit SPI Bus Serial EEPROM Data Sheet of devices.Notification Status: FinalDescription of Change:1. Added Product Identification System section for Automotive; Updated DFN, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings; Removed X-rotated TSSOP package offerings; Replaced terminology “Master” and “Slave” with “Host” and “Client”, respectively; Replaced “Automotive (E):” designation with “Extended (E):” designation; Reformatted some sections for better readability.Impacts to Data Sheet: See above detailsReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 06 January 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper wire with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame design.Estimated Qualification Completion Date:March 2021
Statut du produit:
Microchip 25LC020A-I/SN - Caractéristiques techniques
| Memory Density: | 2kb |
| Memory Organization: | 256 x 8 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Clock Frequency-Max: | 10MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The memory is accessed via a simple Serial Peripheral Interface (SPI) compatible serial bus.
Features:
- Low-power CMOS technology:
- Max. Write Current: 5 mA at 5.5 V, 10 MHz
- Read Current: 5 mA at 5.5 V, 10 MHz
- Standby Current: 5 μA at 5.5 V
- 256 x 8-bit organization
- Write Page mode (up to 16 bytes)
- Sequential Read
- Self-timed Erase and Write cycles (5 ms max.)
- Block Write protection:
- Protect none, 1/4, 1/2 or all of array
- Built-in Write protection:
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin
- High reliability:
- Endurance: 1,000,000 Erase/Write cycles
- Data retention: > 200 years
- ESD protection: > 4000 V
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount