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Référence fabricant
AT25160B-XHL-B
EEPROM SERIAL EEPROM 16K (2K X 8) SPI 1.8V
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :100 par Tube |
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Microchip AT25160B-XHL-B - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 25LC128, 25AA128, 25AA256, 25LC256, 24LC024, 24LC025, 24AA024, 24AA044, 24LC014, 24AA014, 24AA025, AT93C86, 93LC76C, 93AA76C, 93LC86C, 93AA86C, 93C76C, 93C86C, 93LC76A, 93LC76B, 93AA76B, 93AA76A, 93C86A, 93C86B, 93AA86A, 93C76A, 93C76B, 93LC86A, 93LC86B, 93AA86B, 24AA01H, 24LC04B, 24AA02, 24LC02B, 24LC01B, 24FC02, 24FC04, 24AA01, 24FC04H, 24FC01, 24AA04, 24AA02H, 24AA04H, 24FC16, 24LC16B, 24AA08, 24LC08B, 24AA16H, 24AA08H, 24FC08, 24AA16, 25AA080, 25LC080, 25AA160, AT25080, 25LC160, AT25160, AT25320, 25CS320, 25AA320, 25LC320, 25LC640, 25CS640, and 25AA640 device families available in 8L TSSOP (4.4mm) package at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material at MMT assembly site.Change Implementation Status: In ProgressEstimated First Ship Date: 15 April 2026 (date code: 2616)
***UPDATE OF PCN109251 & PCN109508***Revision History: November 26, 2024: Issued initial notification.December 03, 2024: Re-issued initial notification. Corrected the year to April 2025 in the Timetable SummaryDecember 23, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on March 01, 2026. Added column "Change (Yes/No)" in the pre and post change table.Description of Change: Qualification of 36.5K process technology for selected products of the 25AA080C, 25AA080D, 25AA160C, 25AA160D, 25LC080C, 25LC080D, 25LC160C, 25LC160D, AT25080B and AT25160B device families.Reason for Change: To improve manufacturability by qualifying additional process technology.Estimated First Ship Date: 01 March 2026 (date code: 2609)
Description of Change: Qualification of 36.5K process technology for selected products of the 25AA080C, 25AA080D, 25AA160C, 25AA160D, 25LC080C, 25LC080D, 25LC160C, 25LC160D, AT25080Band AT25160B device families.Reason for Change: To improve manufacturability by qualifying additional process technology.
Description of Change: Qualification of 36.5K process technology for selected products of the 25AA080C, 25AA080D, 25AA160C, 25AA160D, 25LC080C, 25LC080D, 25LC160C, 25LC160D, AT25080B and AT25160B device families.Reason for Change: To improve manufacturability by qualifying additional process technology.
Statut du produit:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=AT25160B-XHL-B&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--RAM--eeprom--spi-interface-protocol/at25160b-xhl-b-microchip-6172242
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=AT25160B-XHL-B&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--RAM--eeprom--spi-interface-protocol/at25160b-xhl-b-microchip-6172242
Emballages disponibles
Qté d'emballage(s) :
100 par Tube