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Manufacturer Part #
PIC24FJ256GB110T-I/PT
PIC24FSeries 16 kB RAM 256 kB Flash 16-Bit Microcontroller SMT - TQFP-100
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1200 per Reel Package Style:TQFP-100 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC24FJ256GB110T-I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of 4900F as new die-attach material and G631H as new mold compound material for selected dsPIC33FJ128xx, dsPIC33FJ256xx, dsPIC33FJ32Gxx, dsPIC33FJ64xx, MTR1202xx, PIC18F9xx, PIC24FJ128Gxx, PIC24FJ192Gxx, PIC24FJ256Gxx, PIC24FJ64Gxx, PIC24FJ96Gxx, PIC24HJ128GPxx, PIC24HJ256GPxx, and PIC24HJ64GPxx device families available in 100L TQFP (12x12x1mm) package.Reason for Change:To improve manufacturability by qualifying 4900F as new die-attach material and G631H as new mold compound material.Change Implementation Status:In ProgressEstimated First Ship Date:September 17, 2024 (date code: 2438)
Description of Change:Qualification of 4900F as new die-attach material and G631H as new mold compound material for selected dsPIC33FJ128xx, dsPIC33FJ256xx, dsPIC33FJ32Gxx, dsPIC33FJ64xx, MTR1202xx, PIC18F9xx, PIC24FJ128Gxx, PIC24FJ192Gxx, PIC24FJ256Gxx, PIC24FJ64Gxx, PIC24FJ96Gxx, PIC24HJ128GPxx, PIC24HJ256GPxx, and PIC24HJ64GPxx device families available in 100L TQFP (12x12x1mm) package.Reason for Change:To improve manufacturability by qualifying 4900F as new die-attach material and G631H as new mold compound material.
Final Notice: Qualification of 100L TQFP (12x12x1mm) with 240x240 Lead-Frame Paddle size at ASAC (UDG) assembly site. Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI and ASAC assembly sites.Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC24FJ256GB110T-I/PT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--16-bit-general-purpose/pic24fj256gb110t-i-pt-microchip-2000689
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC24FJ256GB110T-I/PT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--16-bit-general-purpose/pic24fj256gb110t-i-pt-microchip-2000689
Microchip PIC24FJ256GB110T-I/PT - Technical Attributes
| Family Name: | PIC24F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 256kB |
| RAM Size: | 16kB |
| Speed: | 32MHz |
| No of I/O Lines: | 83 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USB OTG |
| Peripherals: | LVD/POR/PWM/Watchdog |
| Supply Voltage: | 2V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 16-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-100 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
1200 per Reel
Package Style:
TQFP-100
Mounting Method:
Surface Mount