Référence fabricant
R7FA6M2AD3CFB#BA0
MCU RA6 ARM CM4 120MHZ 512K/384K QFP144
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Renesas | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :480 par Tray | ||||||||||
| Code de date: | |||||||||||
Renesas R7FA6M2AD3CFB#BA0 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Die-bonding materials will be changed for assembly location RSB (Renesas Semiconductor (Beijing) Co., Ltd).The new materials are already proven and used for other products in RSB assembly.No samples planned because the changed materials are already well known and used in mass production for other products.Reason for Change:To ensure stable supply
Description of Change:Renesas will change packing form with a tray to Full Carton (full packing) from fraction. Full Carton shipment will be standard and combine maximum 3 production lots at worst case. Booking Part Number and Order quantity will be changed.Reason for Change: To secure a stable product supply and environment friendly strengthening (Improvement of efficiency in use of packaging resources, reduction of waste)
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
480 par Tray