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Référence fabricant
PIC10F202T-I/OT
Tèlèchargez les modèles CAD pour ce produit. En savoir plus sur SnapMagic.
3000 par Reel
SOT-23-6 (SOT-26)
Surface Mount
Informations de livraison:
Le pays d’origine (COO) est attribué au moment de l’expédition et ne peut pas être sélectionné lors du processus de commande. Tous les documents indiqueront le COO au moment de l’expédition.
Code HTS:
ECCN:
Informations PCN:
***UPDATE OF PCN115155***Revision History: August 12, 2025: Issued initial notification.October 16, 2025: Issued final notification. Updated affected part list to removeDescription of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 06 November 2025 (date code: 2545)
***UPDATE OF PCN109250 & PCN111719***Description of Change: Qualification of CuPdAu as a new wire material and 8006NS as a new die attach material for selected 24AA014, 24AA025xxx, 24C01C, 24LC014, 24LC025, 24VL014, 24VL025, 25AA010A, 25AA02xx, 25AA040A, 25LC010A, 25LC020A, 25LC040A, 34AA02, 34LC02, 34VL02, MTCH101 and PIC10F2xx device families available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve productivity by qualifying CuPdAu as a new wire material at MTAI assembly site.Estimated First Ship Date: 11 April 2025 (date code: 2515)
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of CuPdAu as a new wire material for selected 24AA014, 24AA025, 24C01C, 24LC014, 24LC025, 24VL014, 24VL025, 25AA010A, 25AA02xx, 25AA040A,25LC010A, 25LC020A, 25LC040A, 34AA02, 34LC02, 34VL02, MTCH101 and PIC10F2xx device families available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve productivity by qualifying CuPdAu as a new wire material at MTAI assembly site.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material for selected 24AA0x, 24C01C, 24LC0x, 24VL0x, 25AA0x, 25LC0x, 34AA02, 34LC02, 34VL02, 93AAx, 93C46x, 93C56x, 93C66x, 93C76x, 93C86x, 93LCx, MCP64x, MCP6V1x, MCP6V3x, MCP6V6x, MCP6V7x, MCP6V8x, MCP6V9x, MCP9x, MTCH101, PIC10F20x, PIC10F22x, device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:05 December 2024 (date code: 2449)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 93LCxxx, 93AAxxx, 93Cxxx, PIC10F2xx, 25LC0xxx, 25AA0xxx, MTCH101,24VL0xx, 24LC0xx, 24AA0xxx, 24C01C, 34VL02, 34LC02, 34AA02, MCP40xx, MCP9800xx, MCP9802xx, MCP738xx, MCP950xx, MCP6Vxxx, and MCP64xx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Statut du produit:
Microchip provides solutions for the entire performance range of 8-bit, 16-bit, and 32-bit microcontrollers, with a powerful architecture, flexible memory technologies, comprehensive easy-to-use development tools, complete technical documentation and post design-in support through a global sales and distribution network.16-bit PIC Microcontrollers & dsPIC Digital Signal Controllers. Microchip offers two 16-bit Microcontroller (MCU) families plus two 16-bit Digital Signal Controller (DSC) families that give you compatible options across a wide spectrum of price, performance and feature sets.
The PIC10F202 is a low-cost, high-performance, 8-bit, fully-static, Flash-based CMOS microcontroller. It employs a RISC architecture with only 33 single-word/ single-cycle instructions. All instructions are single cycle (1 µs) except for program branches, which take two cycles. It delivers performance in an order of magnitude higher than competitors in the same price category. The easy-to-use and easy to remember instruction set reduces development time significantly.
PIC10F202T-I/OT is part of the PIC10F Series family with a 8-Bit Flash Microcontroller.It can sustain standard temperature ranges from -40 to 125 and has SOT package. This device is lead free.
Features:
To learn more about the PIC10F202T product family, Click Here.
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.