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Manufacturer Part #
MCP6232T-E/MNY
MCP6232 Series 6 V 300 kHz Rail-to-Rail Dual Operational Amplifier - TDFN-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:TDFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP6232T-E/MNY - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
****FPCN108254 UPDATE****Description of Change: Qualification of MMT as an additional assembly site for MCP6V03T-E/MNY, MCP6232T-E/MNY, MCP6V06T-E/MNY, MCP6V08T-E/MNY, MCP6V01T-E/MNY, MCP6052T-E/MNY, MCP6062T-E/MNY, MCP6402T-E/MNY, MCP6072T-E/MNY, MCP651T-E/MNY, MCP6051T-E/MNY, MCP6071T-E/MNY, MCP6061T-E/MNY, MCP661T-E/MNY, MCP6442T-E/MNY, MCP621T-E/MNY, MCP631T-E/MNY, MCP6V28T-E/MNY, MCP6V26T-E/MNY, MCP16251T-I/MNY, MCP16252T-I/MNY catalog part numbers (CPN) available in 8L TDFN (2x3x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Description of Change: Qualification of MMT as an additional assembly site for MCP6V03T-E/MNY, MCP6232T-E/MNY, MCP6V06T-E/MNY, MCP6V08T-E/MNY, MCP6V01T-E/MNY, MCP6052T-E/MNY, MCP6062T-E/MNY, MCP6402T-E/MNY, MCP6072T-E/MNY, MCP651T-E/MNY, MCP6051T-E/MNY, MCP6071T-E/MNY, MCP6061T-E/MNY, MCP661T-E/MNY, MCP6442T-E/MNY, MCP621T-E/MNY, MCP631T-E/MNY, MCP6V28T-E/MNY, MCP6V26T-E/MNY, MCP16251T-I/MNY, MCP16252T-I/MNY catalog part numbers (CPN) available in 8L TDFN (2x3x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site
Microchip has released a new Datasheet for the MCP6231/1R/1U/2/4 - 20 uA, 300 kHz Rail-to-Rail Op Amp Data Sheet of devices. If you are using one of these devices please read the document located at MCP6231/1R/1U/2/4 - 20 uA, 300 kHz Rail-to-Rail Op Amp Data Sheet.Notification Status: FinalDescription of Change:? Updated Product Identification System.? Added Product Identification System (Automotive).? Made minor text and format changes throughout the document.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 21 Jun 2023 NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP6232T-E/MNY&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--analog--amplifiers--general-purpose/mcp6232t-e-mny-microchip-4031607
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP6232T-E/MNY&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--analog--amplifiers--general-purpose/mcp6232t-e-mny-microchip-4031607
Microchip MCP6232T-E/MNY - Technical Attributes
| No of Channels: | 2 |
| Slew Rate-Nom: | 0.15V/µs |
| Input Offset Voltage-Max: | 7mV |
| Package Style: | TDFN-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
TDFN-8
Mounting Method:
Surface Mount